Magnetic IC Package With Coated Particles for Breakdown Voltage
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Solution Overview
Problem
The integration of inductors and semiconductor dies in integrated circuits faces challenges with electrical insulation and magnetic field density, leading to reduced reliability and safety due to electrical shorts and leakage currents, particularly after the dicing process which exposes metal particles and reduces the breakdown voltage.
Innovation Solution
A magnetic material comprising coated metal particles with a first insulation material and suspended in a second insulation material, such as Epoxy resin, is used to encapsulate the inductor and semiconductor die, enhancing electrical insulation and increasing the breakdown voltage, and cavities are created on diced surfaces to further reduce leakage paths.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Use of energy by moving object
If a magnetic material with metal particles is used to encapsulate the inductor and semiconductor die, then magnetic field density is improved, but electrical insulation deteriorates due to exposed metal particles after dicing
Solution Approach 1:
The magnetic material is formulated as a composite containing metal particles suspended in an insulating resin matrix. This composite structure provides both magnetic field density enhancement from the metal particles and electrical insulation from the resin, resolving the contradiction between magnetic performance and electrical insulation.
Solution Approach 2:
The insulating resin acts as an intermediary material between the metal particles and the external environment. It coats and isolates the metal particles, preventing direct electrical contact while allowing the magnetic field to pass through, thus maintaining both magnetic density and electrical insulation.
2Reliability
If the breakdown voltage is increased to reduce electrical shorts, then reliability is improved, but the dicing process reduces breakdown voltage due to exposure of metal particles
Solution Approach 1:
The insulating resin is applied beforehand to coat the metal particles before the dicing process. This pre-protection cushioning ensures that even when the package is diced and metal particles are exposed, they remain electrically isolated by the resin coating, maintaining breakdown voltage despite the manufacturing process.
Solution Approach 2:
A thin film of insulating resin is formed around the metal particles, creating a flexible protective shell. This thin film is sufficient to prevent electrical shorts while being compatible with the dicing process, allowing the package to be manufactured without compromising breakdown voltage.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The solution effectively increases the resistance of leakage current paths, reducing the risk of electrical shorts and improving the functionality, reliability, and safety of integrated circuits by maintaining high breakdown voltage and insulation even after the dicing process.
Implementation Method 1
The magnetic material encapsulates the inductor and the semiconductor die, the magnetic material including: coated metal particles, which are coated with a first insulation material; and a second insulation material, in which the coated metal particles are suspended
Implementation Method 2
An inductor can store energy in a magnetic field when electric current flows through it
Data Source
AI summary
In one example, an integrated circuit comprises: a substrate; a semiconductor die; metal interconnects, the semiconductor die being mounted to the substrate via the metal interconnects; an inductor mounted to the substrate; and a magnetic material encapsulating the semiconductor die, the inductor, and the metal interconnects, the magnetic material including: coated metal particles, which are coated with a first insulation material; and a second insulation material, in which the coated metal particles are suspended.