Magnetic-Material Inductive Coupler for Compact Galvanic Isolation
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Solution Overview
Problem
Inductive data couplers face limitations in signal or energy transmission due to small coil sizes, high costs, low inductance, and power dissipation, along with increased system complexity and reduced insulating capability when using magnetic cores for galvanic isolation.
Innovation Solution
An inductive coupler design incorporating a multi-layer stack with a transformer having windings in different metallization layers and a magnetic material adjacent to the transformer, which acts as a magnetic core to enhance magnetic field confinement and energy efficiency, allowing for a coreless transformer with improved inductance and reduced size without compromising insulation.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Power
If larger coils with higher number of windings are used to improve signal or energy transmission, then transmission energy is improved, but chip area and manufacturing cost increase
Solution Approach 1:
The patent changes the physical parameters of the inductor by introducing a magnetic core material with high permeability, which increases the inductance value without requiring larger coil dimensions or more windings, thus maintaining the same chip area while improving transmission energy
Solution Approach 2:
The patent uses composite structures combining magnetic core materials (ferromagnetic or ferrimagnetic) with planar coil structures to achieve high inductance in a compact form factor, resolving the contradiction between transmission energy and chip area
2Power
If magnetic core is placed between primary and secondary coils to increase inductance, then inductance is improved, but insulating capability and safety are reduced
Solution Approach 1:
The patent introduces an intermediary insulating layer between the magnetic core and the coils, which allows the magnetic core to be present for inductance enhancement while the insulating layer maintains the electrical isolation and safety requirements
Solution Approach 2:
The patent applies different material properties to different regions: magnetic core material is placed in specific locations to enhance inductance where needed, while insulating materials are placed in critical regions to maintain electrical isolation, achieving both high inductance and reliable insulation
3Reliability
If planar primary and secondary coils are separated by insulating material for galvanic isolation, then safety is improved, but system complexity increases due to additional power supply requirements
Solution Approach 1:
The patent merges the transformer function with the isolation function by using a magnetic core coupled with planar coils in a integrated structure, enabling both galvanic isolation and power transfer in a single component, thereby reducing system complexity
4Reliability
If coreless inductors are used to avoid insulation issues, then insulating capability is maintained, but inductance and power dissipation performance deteriorate
Solution Approach 1:
The patent segments the inductor structure into distinct functional parts: the magnetic core for inductance enhancement and the planar coils for electrical connection and insulation, allowing each part to optimize its function independently
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The design increases inductance and energy efficiency, enables inductive power supply on the secondary side, and reduces system complexity by confining magnetic fields within the coils, thus enhancing overall performance and efficiency.
Implementation Method 1
The inductive coupler includes a magnetic material that increases the magnetic field generated by the inductive coupler and confining the magnetic field to the coils or inductors of the inductive coupler
Implementation Method 2
a first winding and a second winding that are inductively coupled to one another
Data Source
AI summary
A semiconductor die includes: a semiconductor substrate; a transmitter or receiver circuit in the semiconductor substrate; a multi-layer stack on the semiconductor substrate, the multi-layer stack including a plurality of metallization layers separated from one another by an interlayer dielectric; and a transformer in the multi-layer stack and electrically coupled to the transmitter or receiver circuit. The transformer includes a first winding formed in a first metallization layer of the plurality of metallization layers and a second winding formed in a second metallization layer of the plurality of metallization layers. The first winding and the second winding are inductively coupled to one another. A magnetic material in the multi-layer stack is adjacent to at least part of the transformer.