Magnetic Encapsulated Inductor Structure for Ultra-Thin High Isolation
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Solution Overview
Problem
Integrated inductors face challenges in achieving ultra-thin dimensions without breaking and maintaining high breakdown voltage between layers, due to limitations in high-tonnage pressing technology and potential issues like silver migration and voltage breakdown, which are not met by wire wound assembled inductors.
Innovation Solution
The development of inductors with a structure that includes a coil body and lead-out terminals encapsulated in a magnetic material-based encapsulation body, using electroplating processes for forming the coil and terminals, and incorporating magnetic particles like carbonyl iron powder to enhance conductivity and structural integrity, while allowing for exposure of terminals for electrical connections.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Volume of moving object
If high-tonnage pressing technology is used to create ultra-thin inductors, then the size is reduced, but the inductors are easily broken and breakdown voltage is compromised
Solution Approach 1:
The patent uses a composite encapsulation structure combining magnetic material encapsulation body and resin encapsulation body. The magnetic material encapsulation body provides mechanical strength and magnetic properties, while the resin encapsulation body provides electrical insulation and protects against silver migration, creating a composite solution that resolves the contradiction between thin size and high breakdown voltage
Solution Approach 2:
The patent transitions from planar windings to three-dimensional stacked windings, allowing the inductor to achieve the required inductance value in a thinner profile. This dimensional change enables ultra-thin design without compromising electrical performance or reliability
2Volume of moving object
If integrated inductor structure is used, then size is reduced, but structural strength is compromised making them easy to break
Solution Approach 1:
The dual-encapsulation structure combines magnetic material and resin materials, where the magnetic material encapsulation body provides mechanical support and structural strength, while maintaining the compact integrated form factor. This composite approach solves the contradiction between small size and structural strength
Solution Approach 2:
The magnetic material encapsulation body serves as a protective shell that cushions and protects the internal windings from mechanical damage before stress can cause failure. This pre-protective structure prevents breaking while maintaining ultra-thin dimensions
3Ease of manufacture
If conventional encapsulation is used, then manufacturing is simple, but silver migration and voltage breakdown occur
Solution Approach 1:
The patent employs a two-layer encapsulation system where the resin encapsulation body specifically addresses silver migration and voltage breakdown issues through its electrical insulation properties, while the magnetic material encapsulation body provides structural support. This composite approach maintains manufacturing simplicity while solving reliability issues
Solution Approach 2:
The resin encapsulation body acts as an intermediary barrier between the conductive windings and the external environment, preventing silver migration and electrical breakdown. This intermediary layer protects the internal structure while allowing the overall manufacturing process to remain straightforward
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This approach enables the creation of inductors with improved conductivity and structural strength, suitable for ultra-thin sizes, while minimizing the risk of voltage breakdown and silver migration, thus achieving high breakdown voltage and small size requirements.
Implementation Method 1
incorporating magnetic particles like carbonyl iron powder to enhance conductivity and structural integrity
Implementation Method 2
using electroplating processes for forming the coil and terminals
Data Source
AI summary
An inductor can include at least one winding, where each winding comprises a coil body and at least two lead-out terminals being in contact with the coil body; a first encapsulation body configured to at least encapsulate part of the lead-out terminals and part of the coil body, and to expose the lead-out terminals; and where the first encapsulation body includes an insulating main material and magnetic particles dispersed in the insulating main material.