Magnetic Inductor Package Layout for Compact IC Isolation
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Solution Overview
Problem
Existing integrated circuits with inductors face challenges in reducing footprint and interconnect length while maintaining efficient energy conversion and electrical insulation, leading to potential electrical shorts and reduced reliability.
Innovation Solution
The integration of a semiconductor die, metal interconnects, an insulation layer, and a magnetic material encapsulation package, where the magnetic material surrounds the inductor, semiconductor die, and metal interconnects, enhancing magnetic field density and electrical insulation, and forming a compact structure with reduced parasitic capacitance.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Area of stationary object
If the inductor and semiconductor die are integrated in a compact package, then the footprint and interconnect length are reduced, but the risk of electrical shorts increases due to insufficient insulation
Solution Approach 1:
The patent employs a dual-material encapsulation system: a magnetic material (ferrite or iron powder) provides magnetic field enhancement for the inductor, while a separate insulation material (epoxy molding compound or polyimide) provides electrical isolation. This composite approach allows the inductor and semiconductor die to be placed in close proximity without electrical shorts, resolving the contradiction between compact footprint and insulation reliability.
Solution Approach 2:
The insulation layer acts as an intermediary barrier between the metal interconnects and surrounding structures. This intermediate insulation material layer prevents direct electrical contact between conductive elements, enabling reduced interconnect length and smaller footprint while maintaining electrical isolation and preventing shorts.
2Use of energy by moving object
If the inductor is enclosed in a magnetic package, then the magnetic field density is enhanced for better energy conversion, but the electrical insulation requirements become more stringent
Solution Approach 1:
The patent uses composite encapsulation where magnetic material (for field density enhancement) and insulation material (for electrical isolation) are combined in a single package structure. The magnetic material increases energy conversion efficiency by concentrating magnetic flux, while the insulation material simultaneously provides the necessary electrical barrier, resolving the contradiction between magnetic performance and insulation reliability.
Solution Approach 2:
Different regions of the encapsulation serve different functions: the magnetic material is positioned to maximize magnetic field density around the inductor, while insulation material is strategically placed in regions requiring electrical isolation. This localized functional differentiation allows optimized energy conversion without compromising insulation reliability.
3Reliability
If the metal interconnects are shortened to reduce parasitic capacitance, then the signal integrity improves, but the manufacturing precision requirements increase
Solution Approach 1:
The insulation layer is formed beforehand to define precise locations and dimensions before metal interconnects are deposited. This preliminary insulation structure serves as a template that guides interconnect placement, reducing the actual manufacturing precision required for the interconnects themselves while achieving short lengths for optimal signal integrity.
Solution Approach 2:
The insulation layer acts as an intermediary reference structure that simplifies the positioning of metal interconnects. By providing pre-defined insulation boundaries and spacing, the intermediary insulation layer reduces the precision burden on subsequent interconnect fabrication steps while enabling short, optimized interconnect lengths.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This configuration improves the efficiency of energy conversion, reduces the risk of electrical shorts, and enhances the reliability and safety of the integrated circuit by increasing magnetic field density and providing effective electrical insulation, thus addressing the challenges of footprint reduction and interconnect length.
Implementation Method 1
An inductor can store energy in a magnetic field when electric current flows through it
Implementation Method 2
The magnetic material encapsulates the semiconductor die, the inductor, the metal interconnects, and the insulation layer
Implementation Method 3
The insulation layer is coupled between the semiconductor die and the substrate and surrounds the metal interconnects
Data Source
AI summary
In one example, an integrated circuit comprises: a substrate; a semiconductor die; metal interconnects coupled between the semiconductor die and the substrate; an insulation layer coupled between the semiconductor die and the substrate, the insulation layer surrounding the metal interconnects; an inductor coupled to the substrate; and a magnetic material encapsulating the semiconductor die, the inductor, the metal interconnects and the insulation layer, the magnetic material having a different material from the insulation layer.