Magnetic Inlay With Horizontal Current Flow For Component Carriers

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Solution Overview

Problem

Conventional component carriers face challenges with low inductance values, high production costs, and high ohmic resistances due to the vertical electric current flow direction through magnetic materials, which limits their efficiency and robustness, especially in miniaturized electronic components and harsh conditions.

Innovation Solution

A component carrier design featuring a magnetic inlay with a magnetic matrix and an inductive element where the electric current flow direction is horizontal, allowing for a larger amount of magnetic material to be used, reducing ohmic resistance, and increasing inductance values, while maintaining mechanical robustness and efficiency.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Reliability

If magnetic material is printed into drilled holes with vertical current flow direction, then magnetic enhancement is achieved, but inductance values remain low and ohmic resistance is high

Engineering Contradiction:

Improvemagnetic enhancement reliabilityVSAvoidinductance value precision

Core Design Contradiction:

ReliabilityVSManufacturing precision

Solution Approach 1:

The patent inverts the conventional vertical current flow direction to a horizontal current flow direction through the magnetic material. This inversion allows the current to flow parallel to the circuit board surface rather than perpendicular to it, thereby increasing the path length through the magnetic material and achieving higher inductance values while reducing ohmic resistance.

Inventive Principle:

Principle #13The other way round (Inversion)

Solution Approach 2:

The patent transitions from a one-dimensional vertical current path through the magnetic material to a two-dimensional horizontal current path that extends laterally through the magnetic material. This dimensional change enables a longer current path and larger effective area, resulting in higher inductance values.

Inventive Principle:

Principle #17Another dimension (Dimensionality change)

2Ease of manufacture

If conventional vertical current flow through magnetic material is used, then manufacturing process is simple, but production costs are high and efficiency is low

Engineering Contradiction:

Improvemanufacturing process simplicityVSAvoidproduction efficiency

Core Design Contradiction:

Ease of manufactureVSProductivity

Solution Approach 1:

The horizontal current flow design serves multiple functions simultaneously: it increases inductance values, reduces ohmic resistance, improves heat dissipation efficiency, and maintains compatibility with standard PCB manufacturing processes. This multi-functionality achieves higher productivity without sacrificing ease of manufacture.

Inventive Principle:

Principle #6Universality (Multi-functionality)

3Reliability

If magnetic material is used in conventional design, then magnetic enhancement is provided, but inductance values are low and production efforts are high

Engineering Contradiction:

Improvemagnetic enhancementVSAvoidproduction efforts

Core Design Contradiction:

ReliabilityVSDevice complexity

Solution Approach 1:

The patent merges the magnetic material integration with the PCB manufacturing process itself, rather than treating it as a separate post-processing step. The magnetic material is applied and processed within the standard PCB fabrication sequence, combining multiple functions into a unified manufacturing flow and reducing overall production efforts.

Inventive Principle:

Principle #5Merging (Combining)

4Device complexity

If vertical current flow through magnetic material is used, then component carrier structure is simple, but ohmic resistance is high and robustness is low

Engineering Contradiction:

Improvecomponent carrier structureVSAvoidrobustness under harsh conditions

Core Design Contradiction:

Device complexityVSReliability

Solution Approach 1:

The patent inverts the current flow direction from vertical to horizontal, which fundamentally changes the interaction between the current path and the magnetic material. This inversion reduces ohmic resistance by providing a longer, more efficient current path through the magnetic material, thereby improving robustness under harsh operating conditions while maintaining structural simplicity.

Inventive Principle:

Principle #13The other way round (Inversion)

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

This design achieves higher inductance values with lower ohmic resistance and reduced manufacturing costs, enabling efficient and robust magnetically enhanced inductance in component carriers, suitable for harsh conditions and miniaturized electronic components.

Implementation Method 1

the inductive element is at least partially enclosed by the magnetic matrix, so that an electric current flow direction through the inductive element is essentially in a horizontal direction

Methodology Applied

Scientific EffectMagnetic field concentration: Magnetic Field

Data Source

PatentUS20220377917A1Component Carrier With Magnetic Element, Magnetic Inlay, and Manufacturing Method

Publication Date: 2022.11.24 AT & S AUSTRIA TECHNOLOGIE & SYSTEMTECHNIK AG

AI summary

A component carrier includes a stack having at least one electrically conductive layer structure and/or at least one electrically insulating layer structure and a magnetic element assembled to the stack. The magnetic element includes a magnetic matrix and an inductive element. The inductive element is at least partially enclosed by the magnetic matrix, so that an electric current flow direction through the inductive element is essentially in a horizontal direction with respect to the stack. Further, a magnetic inlay and a manufacturing method are described.