Magnetic-Layer Inductor Structure for Compact Integrated Passive Devices
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Solution Overview
Problem
There is an ongoing need for smaller packages with improved performance, particularly in integrated devices and passive devices, where existing technologies struggle to enhance inductor quality factor and inductance while maintaining a compact form factor.
Innovation Solution
The integration of a magnetic layer surrounding interconnects and a dielectric layer surrounding the magnetic layer in a die substrate, where the magnetic layer has a permeability greater than 1, enhances the quality factor and inductance of the inductor, allowing for smaller and more compact inductors.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If a magnetic layer is added around interconnects to improve inductor quality factor and inductance, then inductor performance is improved, but device complexity increases
Solution Approach 1:
The magnetic layer is nested around the interconnects, with the dielectric layer nested around the magnetic layer, creating a concentric multi-layer structure. This nesting approach maximizes the magnetic coupling with the inductor while maintaining a compact footprint and minimizing the additional space required by the magnetic components.
Solution Approach 2:
The invention uses composite material structures combining magnetic material layers with dielectric material layers. The magnetic layer provides enhanced magnetic permeability to improve inductor performance, while the dielectric layer provides electrical isolation and structural support, creating a functionally integrated composite structure that addresses multiple requirements simultaneously.
2Reliability
If a magnetic layer is added around interconnects to improve inductor quality factor and inductance, then inductor performance is improved, but manufacturing complexity increases
Solution Approach 1:
The magnetic layer is formed around the interconnects during the fabrication process before final device assembly. This preliminary formation of the magnetic structure allows for integrated processing and reduces the need for separate post-fabrication steps to add magnetic components, thereby simplifying the overall manufacturing workflow.
Solution Approach 2:
The concentric nesting of the magnetic layer around interconnects and the dielectric layer around the magnetic layer creates a self-aligned structure that simplifies fabrication. The nested configuration allows sequential deposition and formation steps to naturally align components without requiring complex alignment procedures.
3Volume of stationary object
If the package size is reduced to create smaller devices, then device compactness is improved, but inductor performance deteriorates
Solution Approach 1:
The invention changes the magnetic permeability parameter by introducing high-permeability magnetic material layers around the interconnects. This parameter change enhances the magnetic flux density and coupling efficiency, allowing the inductor to achieve high quality factor and inductance values within a reduced package size. The magnetic layer effectively concentrates and enhances the magnetic field in a compact volume.
Solution Approach 2:
The composite structure of magnetic and dielectric layers creates a high-permeability, electrically isolated environment around the inductor interconnects. This composite material approach enables superior inductor performance in a compact footprint by optimizing both magnetic coupling and electrical isolation within the limited package volume.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This configuration improves the inductor performance by increasing the quality factor and inductance, enabling the formation of smaller and more compact inductors within integrated devices and passive devices.
Implementation Method 1
The at least one magnetic layer has a permeability greater than 1
Data Source
AI summary
A device comprising a die substrate, a plurality of interconnects located over the die substrate, wherein the plurality of interconnects are configured to operate as an inductor, at least one magnetic layer that surrounds at least part of the plurality of interconnects; and at least one dielectric layer that surrounds the at least one magnetic layer.