Electronic Component Separation Using Magnetic Manipulator and Dual Cutting Tools
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Solution Overview
Problem
Existing methods for separating electronic components, especially small dimensions, face challenges in holding components in place during cutting due to vacuum suction limitations, leading to the use of adhesive foils which increase costs and result in residue issues, and require additional equipment for handling and cleaning.
Innovation Solution
A method involving two sub-processes where a first cutting tool partially cuts the assembly along desired lines, followed by a second tool for complete severing, allowing for precise separation without adhesive foils, using a saw blade for initial cuts and a laser beam for final separation, enabling precise control and reduced wear on tools.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If vacuum suction force is used to hold electronic components during sawing, then small components can be held in place, but vacuum suction is no longer effective for small dimensions
Solution Approach 1:
The patent replaces the vacuum suction system with a magnetic field-based holding system. The manipulator incorporates a magnet that generates a magnetic field to hold the electronic component assembly during cutting operations. This substitution allows effective holding of small components that cannot be held by vacuum suction, while maintaining the manipulator's ability to transport and position the assembly precisely relative to the cutting tool.
2Reliability
If adhesive foils are used to hold components, then small components can be held during cutting, but additional equipment and residue removal systems are required
Solution Approach 1:
The patent extracts and eliminates the adhesive foil system from the process. By using magnetic holding directly on the manipulator, the need for adhesive foils and all associated equipment (unrolling units, UV sources, washing systems) is removed. This simplifies the overall device while maintaining reliable holding of small electronic components during the cutting process.
Solution Approach 2:
The magnetic holding system is integrated directly into the manipulator structure, allowing the manipulator to hold and transport the component assembly without requiring external adhesive applications or removal systems. The magnetic field provides continuous holding throughout the cutting process, eliminating the need for separate adhesive application and cleanup operations.
3Reliability
If adhesive foils are used for holding, then components can be secured during cutting, but residue is left on electronic components
Solution Approach 1:
The patent substitutes the adhesive foil system with a magnetic field-based holding system. The magnet on the manipulator holds the component assembly without leaving any residue on the electronic components. This eliminates the contamination problem associated with adhesive foils while maintaining secure holding during the cutting process.
4Productivity
If complete cutting is done in one step, then separation is achieved quickly, but precision and tool wear are problematic
Solution Approach 1:
The patent segments the cutting process into two distinct steps: a rough cutting step that removes the majority of material quickly, and a finishing step that completes the cut with high precision. This segmentation allows the process to benefit from both high productivity in the first step and high precision in the second step, while also reducing overall tool wear by distributing the workload between two cutting tools.
5Ease of operation
If adhesive foils and additional equipment are used, then small components can be handled, but production costs increase considerably
Solution Approach 1:
The patent extracts and removes the adhesive foil system and all associated expensive equipment (unrolling units, inspection systems, UV sources, washing systems) from the process. The magnetic holding system integrated into the manipulator provides equivalent or superior handling capability for small components without requiring any of this additional equipment, thereby significantly reducing production costs.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This approach enhances precision and reduces costs by eliminating the need for adhesive foils, minimizing tool wear, and allowing higher temperature drying, resulting in faster production with improved product quality and reduced residue.
Implementation Method 1
transporting the partially severed assembly with a manipulator along a second cutting tool such that the cutting lines are severed almost completely, and preferably completely
Data Source
AI summary
The invention relates to a method for separating electronic components, comprising the processing steps of placing an assembly of electronic components on a manipulator, transporting the electronic components with the manipulator along a first cutting tool such that the assembly is cut through only partially along cutting lines in the thickness direction thereof, and transporting the partially severed assembly with a manipulator along a second cutting tool such that the cutting lines are severed almost completely. The invention also relates to a device for separating electronic components, and to a separated electronic component obtainable with the method.