Magnetic Material Modulation via Ion Implantation for MRAM

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Solution Overview

Problem

Current techniques for patterning magnetic materials in integrated circuits, such as MRAM, face challenges in defining nanometer-scale boundaries with precision due to damaging etch processes and difficulty in volatilizing magnetic materials, leading to issues with magnetization control.

Innovation Solution

The method involves implanting dopants into magnetic layers of integrated circuit structures to create regions with reduced or prevented magnetization, using a patterned masking layer to control the implantation and subsequent etching processes, allowing for precise definition of active and non-active areas within the magnetic material.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Manufacturing precision

If reactive ion etch is used to define boundaries of magnetic material, then magnetic material can be patterned and removed, but nanometer-scale precision is difficult to achieve due to damaging effects and difficulty in volatilizing magnetic materials

Engineering Contradiction:
Improveboundary definition precisionVSAvoidetch damage
Core Design Contradiction:
Manufacturing precisionVSObject-affected harmful factors

Solution Approach 1:

The patent replaces the mechanical/chemical etching process with an ion implantation process. Instead of using reactive ion etch to remove magnetic material, the invention uses ion implantation to modify the magnetic properties of the material in situ, creating non-magnetic regions through dopant introduction. This substitution eliminates the damaging effects of etching while achieving the desired boundary definition precision at the nanometer scale.

Inventive Principle:
Principle #28Mechanics substitution (Replace mechanical system)

Solution Approach 2:

The patent changes the physical and chemical parameters of the magnetic material through ion implantation. By introducing dopants such as carbon, nitrogen, or oxygen ions at controlled energies and doses, the magnetic material undergoes parameter changes that convert it from a magnetic state to a non-magnetic state. This allows precise control over the magnetic boundary locations without the damage associated with traditional etching methods.

Inventive Principle:
Principle #35Parameter changes

2Manufacturing precision

If ion implantation is used to prevent magnetization, then precise control over magnetic properties is achieved, but additional process steps are required compared to traditional etching

Engineering Contradiction:
Improvemagnetic boundary precisionVSAvoidfabrication process complexity
Core Design Contradiction:
Manufacturing precisionVSDevice complexity

Solution Approach 1:

The patent merges the boundary definition and magnetic property modification steps into a single ion implantation process. Instead of separate lithography, etching, and magnetic treatment steps, the ion implantation simultaneously defines the boundaries and creates the non-magnetic regions in one operation. This merging reduces overall process complexity despite the advanced nature of the implantation technology.

Inventive Principle:
Principle #5Merging (Combining)

Solution Approach 2:

The patent introduces dopant ions (carbon, nitrogen, oxygen) as intermediaries to achieve the desired magnetic boundary effects. These intermediary species are implanted into the magnetic material to induce non-magnetic regions, serving as a mediator between the ion beam and the magnetic material. This intermediary approach provides precise control over magnetic properties while maintaining a relatively simple process flow.

Inventive Principle:
Principle #24Intermediary (Mediator)

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

This approach effectively reduces magnetization in specific areas, enabling precise control over magnetic properties and improving the precision of magnetic material boundaries, even after annealing in strong magnetic fields, thus enhancing the fabrication of magnetic random access memory (MRAM) structures.

Implementation Method 1

implanting at least a portion of the magnetizable material with a dopant

Methodology Applied
Scientific EffectIon Implantation: Ion Implantation

Data Source

PatentUS10079266B2Modulation of magnetic properties through implantation and associated structures
Publication Date: 2018.09.18 TAHOE RES LTD
  • US10079266B2 patent drawing
  • US10079266B2 patent drawing
  • US10079266B2 patent drawing

AI summary

Embodiments of the present disclosure describe techniques and configurations associated with modulation of magnetic properties through implantation. In one embodiment, a method includes providing a substrate having an integrated circuit (IC) structure disposed on the substrate, the IC structure including a magnetizable material, implanting at least a portion of the magnetizable material with a dopant and magnetizing the magnetizable material, wherein said magnetizing is inhibited in the implanted portion of the magnetizable material. Other embodiments may be described and/or claimed.