Magnetic Memory Capping Layer Adhesion and Surface Roughness Control

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Solution Overview

Problem

Memory devices with magnetoresistance effect elements face challenges in maintaining the magnetic properties of ferromagnetic layers due to surface roughness and atom clumping caused by thermal processing, which affects the performance of the memory cells.

Innovation Solution

A memory device structure incorporating a first and second ferromagnetic layer with a capping layer and electrode, where the capping layer and electrode exhibit high wettability and Vickers hardness, ensuring high adhesiveness and minimizing surface roughness and atom displacement in the ferromagnetic layers, thereby maintaining excellent magnetic properties.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Stability of the object's composition

If thermal processing is applied to the ferromagnetic layer, then the magnetic properties can be adjusted, but surface roughness and atom clumping occur which deteriorate magnetic properties

Engineering Contradiction:
Improvemagnetic propertiesVSAvoidsurface roughness
Core Design Contradiction:
Stability of the object's compositionVSManufacturing precision

Solution Approach 1:

A capping layer is introduced as an intermediary between the ferromagnetic layer and the external environment. This capping layer suppresses atom displacement and prevents clumping during thermal processing, thereby maintaining surface smoothness while allowing magnetic property adjustment through controlled thermal treatment.

Inventive Principle:
Principle #24Intermediary (Mediator)

Solution Approach 2:

The patent controls the composition parameters of the capping layer (specifically containing elements identical to those in the ferromagnetic layer) to optimize its protective function. By adjusting the capping layer's chemical composition, it achieves high adhesiveness to the ferromagnetic layer while preventing surface degradation during thermal processing.

Inventive Principle:
Principle #35Parameter changes

2Strength

If the capping layer includes elements identical to the ferromagnetic layer, then adhesiveness is improved, but material complexity increases

Engineering Contradiction:
ImproveadhesivenessVSAvoidmaterial composition
Core Design Contradiction:
StrengthVSDevice complexity

Solution Approach 1:

The capping layer is designed with local quality by containing specific elements (Fe, Co, Ni, Cu, Zn, Al, Si, B, P) that match the ferromagnetic layer's composition. This localized compositional matching at the interface enhances adhesiveness without requiring the entire capping layer to be complex, as other regions can use simpler protective materials.

Inventive Principle:
Principle #3Local quality

3Manufacturing precision

If the electrode has high Vickers hardness, then surface roughness is minimized, but manufacturing difficulty increases

Engineering Contradiction:
Improvesurface roughnessVSAvoidelectrode fabrication
Core Design Contradiction:
Manufacturing precisionVSEase of manufacture

Solution Approach 1:

The electrode is constructed as a composite material combining high-hardness materials (such as diamond-like carbon or ceramic coatings) with conductive materials. This composite structure achieves both high Vickers hardness for surface protection and minimal roughness, while maintaining electrical conductivity required for device operation.

Inventive Principle:
Principle #40Composite materials

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

The proposed structure suppresses the formation of holes and atom clumping in the ferromagnetic layers, leading to improved magnetic properties and performance of the memory cells, ensuring reliable data storage.

Implementation Method 1

the capping layer and the electrode have high wettability, and thus have high adhesiveness

Methodology Applied
Scientific EffectAdhesion: Adhesive

Implementation Method 2

Memory devices adopting a magnetoresistance effect element have been known

Methodology Applied
Scientific EffectMagnetoresistance effect: Magnetoresistance

Data Source

PatentUS11404098B2Memory device
Publication Date: 2022.08.02 KIOXIA CORP
  • US11404098B2 patent drawing
  • US11404098B2 patent drawing
  • US11404098B2 patent drawing

AI summary

A memory device includes a first ferromagnetic layer, an insulating layer above the first ferromagnetic layer, a second ferromagnetic layer above the insulating layer, a capping layer on an upper surface of the second ferromagnetic layer, and an electrode on an upper surface of the capping layer. The second ferromagnetic layer includes iron atoms. The capping layer includes one or more elements identical to one or more elements in the second ferromagnetic layer. The electrode includes one or more elements identical to one or more of the elements in the capping layer and includes a material having a Vickers hardness higher than a Vickers hardness of an iron atom.