Magnetic Memory Grain Boundary Stabilization

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Solution Overview

Problem

Magnetic memory devices face instability in operations due to issues with grain boundaries and electrical resistance variations, affecting the reliability and speed of write and read operations.

Innovation Solution

A magnetic memory device structure is developed, including a first conductive layer with multiple portions, a compound region containing metals like Hf, Ta, and oxygen or nitrogen, and an insulating region, which reduces grain boundaries and enhances stability by optimizing electrical resistance and electric field distribution.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Reliability

If conventional magnetic memory structure is used, then device complexity is low, but operational stability deteriorates due to grain boundary migration and electrical resistance variations

Engineering Contradiction:
Improveoperational stabilityVSAvoidstructure complexity
Core Design Contradiction:
ReliabilityVSDevice complexity

Solution Approach 1:

The conductive layer is segmented into multiple portions (first conductive layer with first and second portions, second conductive layer with third and fourth portions) that are spatially separated and independently controlled. This segmentation allows independent optimization of each segment's electrical properties and reduces the impact of grain boundary migration in any single region, thereby improving operational stability without requiring complete structural redesign.

Inventive Principle:
Principle #1Segmentation

Solution Approach 2:

A nonmagnetic layer is introduced as an intermediary between the magnetic layer and the conductive layers. This intermediary layer serves multiple functions: it decouples the magnetic layer from direct interaction with conductive layer grain boundaries, reduces electrical resistance variations, and provides a stable interface that improves operational reliability without significantly increasing overall device complexity.

Inventive Principle:
Principle #24Intermediary (Mediator)

2Reliability

If conductive layers with multiple portions are used, then electrical resistance stability is improved, but manufacturing complexity increases

Engineering Contradiction:
Improveelectrical resistance stabilityVSAvoidmanufacturing complexity
Core Design Contradiction:
ReliabilityVSEase of manufacture

Solution Approach 1:

The conductive path is divided into multiple segments (first conductive layer with first and second portions, second conductive layer with third and fourth portions) that can be manufactured using standard sequential deposition techniques. Each segment can be independently optimized for electrical properties, and the segmentation allows for better control of grain boundary formation and electrical resistance stability throughout the device structure.

Inventive Principle:
Principle #1Segmentation

Solution Approach 2:

The patent transitions from a single-plane conductive structure to a multi-layer three-dimensional arrangement. The conductive layers are stacked in different planes with magnetic layers positioned between them, creating a vertical dimension that allows independent optimization of electrical pathways and reduces the impact of grain boundary migration in any single layer on overall device performance.

Inventive Principle:
Principle #17Another dimension (Dimensionality change)

3Reliability

If magnetic layer is separated from conductive layer portions, then grain boundary migration is reduced, but device complexity increases

Engineering Contradiction:
Improveoperational stabilityVSAvoidlayer structure complexity
Core Design Contradiction:
ReliabilityVSDevice complexity

Solution Approach 1:

A nonmagnetic layer is positioned between the magnetic layer and the conductive layers, serving as an intermediary that physically separates the magnetic layer from the conductive layer portions. This separation reduces grain boundary migration effects and electrical resistance variations while maintaining functional coupling through spin-dependent transport. The intermediary layer is thin and can be integrated into existing magnetic tunnel junction structures, limiting the increase in overall device complexity.

Inventive Principle:
Principle #24Intermediary (Mediator)

Solution Approach 2:

The device structure is segmented into distinct functional regions: magnetic layers for data storage, nonmagnetic layers for separation and stabilization, and conductive layers for current transport. This segmentation allows each region to be optimized independently for its specific function, reducing cross-interference and grain boundary migration effects while maintaining a manageable overall structure through modular design.

Inventive Principle:
Principle #1Segmentation

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

The proposed structure increases the stability and reliability of magnetic memory device operations by reducing grain boundary migration and improving the speed and efficiency of write and read operations, while also enhancing the voltage effect.

Implementation Method 1

A magnetic memory device includes a first conductive layer including a first metal, a first compound region including the first metal and at least one selected from the group consisting of oxygen, nitrogen, and fluorine

Methodology Applied
Scientific EffectGrain boundary strengthening: Grain Boundary Strengthening

Implementation Method 2

a first magnetic layer, a first nonmagnetic layer, a second magnetic layer, a second nonmagnetic layer, a third magnetic layer

Methodology Applied
Scientific EffectMagnetoresistance: Magnetoresistance

Data Source

PatentUS10276786B2Magnetic memory
Publication Date: 2019.04.30 KK TOSHIBA
  • US10276786B2 patent drawing
  • US10276786B2 patent drawing
  • US10276786B2 patent drawing

AI summary

According to one embodiment, a magnetic memory device includes a first conductive layer, a first magnetic layer, a first nonmagnetic layer, a second magnetic layer, a second conductive layer, a third magnetic layer, a second nonmagnetic layer, a fourth magnetic layer provided, a first compound region, and a first insulating region. The first compound region includes the first metal and at least one selected from the group consisting of oxygen, nitrogen, and fluorine. At least a portion of the first compound region is provided between the first conductive layer and the second conductive layer. The first insulating region includes at least one selected from the group consisting of Al and Si and at least one selected from the group consisting of oxygen, nitrogen, and fluorine. At least a portion of the first insulating region is provided between the first magnetic layer and the third magnetic layer.