Magnetic Memory Devices Using Lattice Mismatch Bottom Patterns

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Solution Overview

Problem

Magnetic memory devices face challenges in improving switching properties due to inefficiencies in spin-orbit torque application, which affects the performance of magnetic tunnel junctions.

Innovation Solution

Incorporating a conductive line with a specific lattice constant and a bottom pattern with higher nitrogen content than metal content, which applies spin-orbit torque to magnetic tunnel junctions, enhancing the switching efficiency by increasing grain density and resistivity of the conductive line.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Reliability

If a conventional conductive line is used without specific lattice constant control, then the device structure is simpler, but the spin-orbit torque efficiency is insufficient

Engineering Contradiction:
Improveswitching efficiencyVSAvoidlattice constant control
Core Design Contradiction:
ReliabilityVSDevice complexity

Solution Approach 1:

The patent changes the lattice constant parameter of the conductive line material to enhance spin-orbit coupling efficiency. By selecting materials with specific lattice constants that match or mismatch with adjacent layers, the device achieves improved spin-orbit torque efficiency without fundamentally changing the device architecture.

Inventive Principle:
Principle #35Parameter changes

Solution Approach 2:

The patent employs composite material structures where the conductive line is formed by combining multiple materials with different lattice constants. This composite approach allows optimization of spin-orbit torque efficiency through controlled lattice mismatch while maintaining structural integrity and electrical conductivity.

Inventive Principle:
Principle #40Composite materials

2Reliability

If the bottom pattern has low nitrogen content, then the material composition is simpler, but the grain density and resistivity are insufficient for improved switching

Engineering Contradiction:
Improveswitching propertiesVSAvoidnitrogen content control
Core Design Contradiction:
ReliabilityVSDevice complexity

Solution Approach 1:

The patent changes the nitrogen content parameter in the bottom pattern material to control grain density and resistivity. By precisely controlling the nitrogen concentration, the device achieves optimal switching properties through enhanced grain boundary effects and resistivity modulation without complex structural modifications.

Inventive Principle:
Principle #35Parameter changes

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

The solution improves the switching efficiency of magnetic tunnel junctions by increasing the efficiency of spin-orbit torque applied, leading to enhanced performance in magnetic memory devices.

Implementation Method 1

a bottom pattern located between the conductive line and the substrate and in contact with a bottom surface of the conductive line and having a second lattice constant that is less than the first lattice constant of the first conductive line

Methodology Applied
Scientific EffectStress:

Implementation Method 2

Incorporating a conductive line with a specific lattice constant and a bottom pattern with higher nitrogen content than metal content, which applies spin-orbit torque to magnetic tunnel junctions, enhancing the switching efficiency

Methodology Applied
Scientific EffectSpin-orbit torque:

Data Source

PatentUS10930702B2Magnetic memory devices
Publication Date: 2021.02.23 SAMSUNG ELECTRONICS CO LTD
  • US10930702B2 patent drawing
  • US10930702B2 patent drawing
  • US10930702B2 patent drawing

AI summary

A magnetic memory device may include magnetic tunnel junction patterns on a substrate, a conductive line extending between the substrate and the magnetic tunnel junction patterns and in contact with bottom surfaces of the magnetic tunnel junction patterns, and a bottom pattern located between the conductive line and the substrate and in contact with a bottom surface of the conductive line. The material of the conductive line may have a first lattice constant, and the material of the bottom pattern may have a second lattice constant that is less than the first lattice constant of the conductive line. Alternatively or additionally, the bottom pattern includes a metal nitride, and a nitrogen content of the bottom pattern is higher than a metal element content of the metal element.