Magnetic Metal Substrate for High-Current Inductance
Solution Overview
Problem
Conventional inductance devices face challenges in achieving miniaturization, large current use, and high frequency characteristics due to limitations in size reduction, cracking issues with ceramics, and smaller inductance values.
Innovation Solution
A magnetic metal substrate with a metallic substrate, insulating layer, and metallic wiring layer is developed, along with a gap layer and magnetic flux generation layer, to create an inductance device with enhanced permeability, allowing for smaller mounting areas, larger inductance values, and high frequency capabilities.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Quantity of substance
If wire-wound type wiring structure is used, then large current use is achieved, but device size becomes larger making miniaturization difficult
Solution Approach 1:
The patent replaces the traditional mechanical wire-winding structure with a thin-film deposited wiring structure formed by sputtering or plating. This substitution allows the inductance element to achieve large current carrying capacity through the metallic substrate and wiring layer while maintaining a compact, miniaturized form factor that cannot be achieved with conventional wire-wound structures.
Solution Approach 2:
The patent changes the physical parameters of the inductance device by using a metallic substrate with high permeability and controlling the thickness of the substrate and wiring layer. By optimizing these parameters, the device achieves both large current capacity and small size, resolving the contradiction between current carrying capacity and device volume.
2Reliability
If laminated type wiring structure with ceramics is used, then various characteristics are improved, but cracks easily occur limiting thickness reduction
Solution Approach 1:
The patent uses a composite structure consisting of a metallic substrate (such as permalloy or cobalt-based alloy) combined with insulating and wiring layers. This composite material approach provides the reliability and performance characteristics of ceramic-based structures while avoiding the brittleness and cracking issues, enabling significant thickness reduction.
Solution Approach 2:
The patent replaces fragile ceramic materials with more durable metallic substrates that are less prone to cracking. This substitution allows for thinner designs without the reliability penalties associated with ceramic brittleness, effectively removing the constraint on thickness reduction.
3Length of stationary object
If thin film type wiring structure is used, then thickness reduction is achieved, but inductance value becomes smaller making large current use difficult
Solution Approach 1:
The patent changes the material parameters by using a metallic substrate with high permeability (such as permalloy or cobalt-based alloys) instead of conventional thin-film magnetic materials. This parameter change enables the thin-film structure to achieve higher inductance values while maintaining reduced thickness, thus resolving the contradiction between thickness and inductance value.
Solution Approach 2:
The patent creates a composite structure with a metallic magnetic substrate and metallic wiring layer, which together provide enhanced inductance performance in a thin profile. This composite approach allows the device to achieve both thinness and high inductance value suitable for large current applications.
4Device complexity
If conventional ceramics-based inductance device is used, then wirings can be disposed therein, but wirings are formed on the magnetic material not in the magnetic material
Solution Approach 1:
The patent merges the magnetic substrate and wiring structure into a single integrated metallic component. The wiring layer is formed directly on and integrated with the metallic magnetic substrate, eliminating the separation between magnetic material and wiring that exists in conventional ceramic-based devices. This merging simplifies the structure and improves manufacturing precision.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The solution enables the creation of thin, compact inductance devices that support large current use and high frequency operations while reducing noise and eddy currents, thus improving the overall performance and efficiency of inductance devices.
Implementation Method 1
a magnetic metal substrate comprising a metallic substrate having first permeability, a first insulating layer disposed in the metallic substrate, and a first metallic wiring layer having second permeability
Data Source
Figure 1(a)~1(c)
Figure 2(a)~2(b)
Figure 3(a)~3(c)
AI summary
The inductance device (4) includes: a magnetic metal substrate (2) comprising a metallic substrate (10) having first permeability, a first insulating layer (16a) disposed in the metallic substrate (10), and a first metallic wiring layer (22) having second permeability and disposed on the first insulating layer (16a); a first gap layer (24) disposed on the front side surface of the magnetic metal substrate (2); and a first magnetic flux generation layer (26) disposed on the first gap layer (24). There are provide a thin magnetic metal substrate adaptable to the large current use and advantageous in the high frequency characteristics; and an inductance device to which such a magnetic metal substrate are applied, wherein the inductance device is adaptable to smaller mounting area, larger inductance values, and large current use and advantageous in high frequency characteristics.