Magnetic Micro-Element Alignment for Precise Micro-LED Assembly
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Solution Overview
Problem
Existing micro-LED chip assembly technologies face challenges in achieving high-precision alignment and throughput for hybrid integration of micro-LED chips with different semiconductor materials, leading to issues such as random chip orientations and reduced yield, especially when transferring chips with dimensions of about 15 micrometers and electrode widths of three micrometers.
Innovation Solution
A micro-element design with a functional face, a parallel bottom face, circumscribing-ridges, and a magnetic-force receptor, combined with an alignment system using capturing-probes with magnetic-force applying portions, allows for precise alignment and assembly of micro-elements on a mounting substrate by applying magnetic forces to the receptor, ensuring correct orientation and alignment.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Productivity
If existing transfer equipment with pick & place scheme is used, then throughput of 20,000 chips per hour is achieved, but alignment accuracy deteriorates to about 35 micrometers
Solution Approach 1:
The patent replaces the mechanical pick & place system with a magnetic field-based transfer system. Capturing probes with magnetic-force applying portions interact with magnetic-force receptors on the micro-LED chips to enable precise positioning and transfer, achieving both high throughput and high alignment accuracy simultaneously
Solution Approach 2:
The patent introduces magnetic-force receptors as intermediary elements on the micro-LED chips that mediate the interaction between the capturing probes and the chips. This intermediary mechanism enables precise control of chip position and orientation during transfer, resolving the contradiction between speed and precision
2Productivity
If micro-LED chips are shuffled and picked up simultaneously, then throughput is improved, but chip orientation becomes random and alignment accuracy deteriorates
Solution Approach 1:
The patent employs feedback mechanisms where the magnetic field interaction between capturing probes and magnetic-force receptors provides real-time information about chip position and orientation. This feedback enables the system to maintain correct chip orientation even when processing multiple chips simultaneously at high throughput
Solution Approach 2:
The magnetic field-based system replaces mechanical handling that causes random orientation. The magnetic interaction allows for controlled orientation of chips during simultaneous transfer, maintaining ease of operation while improving throughput
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The solution enables high-precision, high-throughput assembly of micro-LED chips with different structures, maintaining yield and alignment accuracy, addressing the challenges of random orientations and improving the efficiency of micro-LED chip integration.
Implementation Method 1
each of the magnetic-force applying portions applies magnetic lines on the magnetic-force receptor to capture one of the micro-elements
Implementation Method 2
applying magnetic lines spreading from each of the magnetic-force applying portions to a magnetic-force receptor
Data Source
AI summary
An alignment system arranges a plurality of micro-elements at positions on a mounting substrate, the micro-elements are equal in dimension and shape. The alignment system encompasses a rough alignment-apparatus including a picker having capturing-probes, each of which having a capturing-face and a magnetic-force applying portion provided on the capturing-face, and a base-plate on which the capturing-probes are arrayed with an array-pattern. In the alignment system, each of the magnetic-force applying portions applies magnetic lines on the magnetic-force receptor to capture one of the micro-elements.