Magnetic Micro LED Chip Assembly With Repairable Fuse Connections
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Solution Overview
Problem
Existing methods for manufacturing micro LED displays are costly and difficult to repair when defects in micro LED chips are detected.
Innovation Solution
A method involving a liquid-droplet-like ink containing micro LED chips with electrodes of differing magnetic attraction is applied to a substrate, joined using an external magnetic field, and connected via a thin film fuse for easy repair by cutting defective connections.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Ease of manufacture
If conventional methods (chip sorter, multichip transfer device, laser ejection, magnetic film) are used to arrange micro LED chips, then the micro LED display can be manufactured, but the manufacturing cost becomes high
Solution Approach 1:
The patent uses a liquid carrier (hydraulic approach) to transport and deposit micro LED chips onto the substrate. The liquid carrier enables low-cost, high-efficiency arrangement by allowing multiple chips to be deposited simultaneously in a single printing process, eliminating the need for expensive conventional equipment like chip sorters or multichip transfer devices.
Solution Approach 2:
The patent changes the physical state of chip arrangement from individual mechanical placement to bulk liquid deposition. By dissolving or suspending multiple micro LED chips in a liquid carrier and controlling the printing parameters (droplet size, deposition pattern), the system achieves high-density arrangement at low cost.
2Ease of repair
If micro LED chips are mounted on substrate using conventional methods, then the display can be assembled, but repair becomes difficult when defects are detected
Solution Approach 1:
The patent divides the substrate into multiple independent pixel regions, with each pixel containing its own micro LED chips arranged in a modular fashion. This segmentation allows defective chips to be identified and replaced individually or in small groups without affecting the entire display, significantly improving repairability while maintaining overall reliability.
Solution Approach 2:
The liquid carrier method allows for easy removal and replacement of micro LED chips. When defects are detected, the liquid carrier can be reapplied to remove defective chips and replace them with new ones, enabling efficient repair and recovery of defective display regions.
3Manufacturing precision
If a large number of micro LED chips are arranged densely on substrate, then display resolution improves, but manufacturing complexity increases
Solution Approach 1:
The patent employs self-aligning features in the liquid carrier system, where the micro LED chips automatically position themselves in correct orientations and locations within the liquid carrier before deposition. This self-service mechanism eliminates the need for complex external alignment equipment and simplifies the manufacturing process while achieving high arrangement precision.
Solution Approach 2:
The micro LED chips are pre-arranged and suspended in the liquid carrier in a predetermined pattern before being deposited onto the substrate. This preliminary arrangement in the liquid phase simplifies the final deposition process and ensures high precision in the chip arrangement on the substrate, reducing manufacturing complexity.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
Enables cost-effective manufacturing and easy repair of micro LED displays, reducing material loss and production costs while allowing for high integration density and ultrafine pixel realization.
Implementation Method 1
joining the semiconductor light emitting element chips to the chip joining part by applying an external magnetic field from the opposite side with respect to the substrate such that the one of the p-side electrode and the n-side electrode faces the chip joining part
Data Source
AI summary
A liquid-droplet-like ink containing a plurality of vertical semiconductor light emitting element chips 40, each of which has a p-side electrode and an n-side electrode on the upper surface and the lower surface and is configured such that one of the p-side electrode and the n-side electrode is more strongly attracted to a magnetic field than the other is supplied to a chip joining part 421 on a lower electrode 420 on a mounting substrate 400, the semiconductor light emitting element chips 40 in the ink are joined to the chip joining part by applying an external magnetic field such that one of the p-side electrode and the n-side electrode faces to the chip joining part, and thereafter an upper electrode 430 having an upper electrode main line part 431 and a plurality of upper electrode branch line parts 432 which are connected by a thin film fuse 433 each other is formed as the upper layer of the semiconductor light emitting element chips 40 such that the other of the p-side electrode and the n-side electrode of the semiconductor light emitting element chip 40 and the upper electrode branch line part 432 are electrically connected each other.