Magnetic Micro LED Transfer Jig for Fast, Accurate Pickup
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Solution Overview
Problem
Current technologies face challenges in transferring micro LEDs of tens to hundreds of μm in size to a board for short-distance displays with high speed and low error rates, which is crucial for efficient production of micro LED displays.
Innovation Solution
A transfer apparatus utilizing a fixing jig, movement jig, and attraction device with magnetism, combined with a redistribution device using a porous material and adhesive force, enables precise and rapid transfer of micro LEDs by picking them up and redistributing them onto a temporary fixing film.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Productivity
If existing methods (stamp, tape, high speed mounter) are used to transfer multiple micro LEDs from base material board to display board, then transfer speed may be improved, but error rate increases and transfer precision deteriorates
Solution Approach 1:
The transfer apparatus divides the base material board into multiple regions with different adhesive forces, allowing selective pickup of micro LEDs from specific regions. This segmentation enables precise control over which micro LEDs are transferred, reducing errors while maintaining high transfer speed through parallel processing of multiple elements.
Solution Approach 2:
The invention applies local quality by creating regions with different adhesive characteristics on the base material board. Each region is tailored to have specific adhesive properties that match the requirements for picking up micro LEDs of different sizes and positions, thereby improving both transfer precision and reliability without sacrificing speed.
2Adaptability or versatility
If micro LEDs of size tens to hundreds of μm are transferred to board, then short distance display implementation is enabled, but transfer precision and accuracy become more difficult to maintain
Solution Approach 1:
The transfer apparatus changes the adhesive force parameter across different regions of the base material board to match the size and weight variations of micro LEDs. By adjusting adhesive force parameters locally, the system maintains high transfer accuracy for micro LEDs ranging from tens to hundreds of micrometers, enabling versatile display implementations while preserving manufacturing precision.
3Productivity
If multi-chip transfer method is used to transfer multiple micro LEDs at a time, then productivity is improved, but control precision and error rate worsen
Solution Approach 1:
The base material board is segmented into multiple adhesive regions, each capable of independently picking up micro LEDs. This segmentation allows the system to transfer multiple chips simultaneously while maintaining precise control over each pickup operation, thereby improving productivity without sacrificing measurement precision or increasing error rates.
Solution Approach 2:
The invention applies partial action by activating only the necessary adhesive regions for each transfer operation. Rather than engaging all regions simultaneously, the system selectively activates specific regions based on the transfer requirements, maintaining high precision while achieving efficient multi-chip transfer through coordinated partial actions.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This solution significantly reduces production time for micro LED displays by ensuring accurate and efficient transfer of micro LEDs, enhancing transfer speed and reducing error rates, thereby facilitating the production of large image apparatuses like TVs.
Implementation Method 1
an attraction device which is disposed in the proximity of the movement jig and is configured to attach each of the plurality of electrical elements to the first accommodation groove of the movement jig by using magnetism through the movement jig
Implementation Method 2
a first porous material portion including a plurality of first penetrating openings spatially connected with the first vacuum portion, and coupled to the first vacuum portion, and a first adhesive member fixed to the first porous material portion and adsorbed onto the first porous material portion by the first vacuum portion
Implementation Method 3
a first vacuum portion
Data Source
AI summary
According to various embodiments, provided is an electrical element transfer apparatus comprising: a fixing jig in which each of a plurality of electrical elements is arranged at a predetermined interval; a movement jig movably arranged at an upper part of the fixing jig, and including a plurality of first accommodating grooves for accommodating at least a part of each of the plurality of electrical elements; and an attraction device arranged around the movable jig and attaching each of the plurality of electrical elements through the movable jig to the first accommodating groove of the movable jig through magnetic force. Additional various embodiments are possible.