Electronic Module Magnetic Device Lead Frame Substrate Impedance
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Solution Overview
Problem
Conventional electronic modules face challenges in meeting different space requirements and increase overall impedance due to the need for substrates between magnetic devices and external motherboards.
Innovation Solution
The electronic module design eliminates the intermediate substrate by extending leads from the magnetic device directly to the substrate and external circuit, allowing for direct electrical connection without the substrate, thereby reducing impedance.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If an intermediate substrate is used to connect the magnetic device to the external motherboard, then the magnetic device can be electrically connected to the external circuit, but the overall impedance of the system increases
Solution Approach 1:
The patent extracts and eliminates the intermediate substrate from the connection path between the magnetic device and the external motherboard. The magnetic device is directly mounted on the external motherboard, removing the substrate that caused impedance increase while maintaining electrical connection through direct soldering of leads to the motherboard.
Solution Approach 2:
The patent uses the external motherboard itself as the intermediary structure that serves dual purposes: providing mechanical support and enabling electrical connection. This eliminates the need for a separate intermediate substrate, thereby reducing impedance while maintaining reliable electrical connection.
2Ease of manufacture
If a substrate is disposed between the magnetic device and the external motherboard, then the magnetic device can be mounted and connected, but the space requirements cannot be flexibly met for different applications
Solution Approach 1:
The patent removes the intermediate substrate that constrained space flexibility. By directly mounting the magnetic device on the external motherboard, the design achieves flexible space utilization while maintaining ease of manufacture through direct soldering connections.
Solution Approach 2:
The patent merges the functions of mounting support and electrical connection into a single structure - the external motherboard. This eliminates the separate intermediate substrate and enables flexible adaptation to different space requirements while maintaining manufacturing simplicity.
3Reliability
If leads go through the substrate for electrical connection, then the magnetic device can be electrically connected to the external motherboard, but the overall impedance of the system increases
Solution Approach 1:
The patent extracts the substrate from the electrical connection path. Leads extend directly from the magnetic device to the external motherboard without penetrating through an intermediate substrate, eliminating the impedance contribution from the substrate material and via holes while maintaining reliable electrical connection.
Solution Approach 2:
The patent changes the connection geometry from a through-substrate path (vertical dimension) to a direct surface mounting path (lateral dimension). Leads extend laterally from the magnetic device to connection points on the external motherboard, avoiding the high-impedance path through the substrate.
Data Source
AI summary
An electronic module includes: a lead frame having at least one metal strip and a plurality of metal leads, wherein a magnetic body encapsulates a portion of each of the at least one metal strip with two ends of each of the at least one metal strip not covered by the magnetic body; and a substrate disposed on the lead frame, wherein the substrate is electrically connected to the plurality of metal leads and the at least one metal strip.