Electric-Programmable Magnetic Module for LED Chip Placement
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Solution Overview
Problem
The challenge in monolithic micro-display technology is achieving efficient picking-up and placement of LED chips with different colored light emitting layers, as their lattice constants differ, making growth on a common substrate difficult, and wavelength conversion materials have low conversion efficiency and are hard to coat uniformly.
Innovation Solution
An electric-programmable magnetic module with a MEMS chip and bonding equipment, featuring individually controlled electromagnetic coils, is used to pick-up and place LED chips on a substrate, enabling precise magnetic force control for efficient placement and bonding.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Adaptability or versatility
If wavelength conversion materials are used to obtain different colored lights, then color variety is improved, but conversion efficiency deteriorates and coating uniformity deteriorates
Solution Approach 1:
The patent replaces the chemical/optical wavelength conversion mechanism with a magnetic manipulation system. Electromagnetic coils generate magnetic fields to directly manipulate and position LED chips, substituting the ineffective wavelength conversion approach with a mechanical/magnetic positioning system that achieves color variety through precise chip placement rather than material conversion
Solution Approach 2:
The patent introduces magnetic fields as an intermediary between the control system and LED chips. The electromagnetic coils generate magnetic fields that interact with magnetic portions on LED chips, enabling precise positioning and manipulation without direct physical contact, thus solving the coating uniformity and conversion efficiency problems
2Adaptability or versatility
If wavelength conversion materials are used to obtain different colored lights, then color variety is improved, but coating uniformity deteriorates
Solution Approach 1:
The patent replaces the coating process with a magnetic manipulation system. Instead of attempting to coat wavelength conversion materials uniformly, the system uses electromagnetic coils to magnetically position LED chips with precise color properties, eliminating the coating uniformity issue entirely
Solution Approach 2:
The patent uses magnetic field patterns as a template or copy to guide the positioning of LED chips. The electromagnetic coils create magnetic field distributions that serve as a blueprint for placing chips in precise locations, ensuring uniformity and precision without physical coating
3Illumination intensity
If LED chips with different colored light emitting layers are handled, then display quality is improved, but handling efficiency deteriorates due to different lattice constants
Solution Approach 1:
The patent creates a universal magnetic manipulation system that can handle all LED chips regardless of their specific color or lattice constant. The electromagnetic coils generate magnetic fields that interact with magnetic portions on any LED chip, providing a single unified approach for manipulating diverse chip types, thus improving handling efficiency while maintaining display quality
Solution Approach 2:
The patent changes the manipulation parameter from physical/chemical properties (lattice constants) to magnetic properties. By using magnetic fields to interact with magnetic portions on LED chips, the system can uniformly handle chips with different lattice constants and color properties, improving both handling efficiency and display quality
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This solution enhances the brightness and display quality of monolithic micro-displays by efficiently handling small electronic devices, overcoming the limitations of existing technologies in colorizing and uniform coating, and is compatible with existing flip chip bonding processes.
Implementation Method 1
The MEMS chip comprises a plurality of electromagnetic coils and each of the electromagnetic coils is individually controlled
Implementation Method 2
enabling precise magnetic force control for efficient placement and bonding
Data Source
AI summary
An electric-programmable magnetic module comprising a micro electro mechanical system (MEMS) chip and a bonding equipment is provided. The MEMS chip comprises a plurality of electromagnetic coils and each of the electromagnetic coils is individually controlled. The MEMS chip is assembled with and carried by the bonding equipment.


