Surface-Mounted Magnetic Module With Wire-Bond Isolation
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Solution Overview
Problem
There is a need for smaller, more efficient, and lower-cost magnetic components that operate with reduced power consumption, particularly in applications like telecommunications and implantable medical devices, where traditional transformers are not optimized for size and power efficiency.
Innovation Solution
The development of magnetic-component modules that include a spacer over a core, with wire bonds extending over the core and substrate, and an overmold material encapsulating the core, spacer, and wire bonds, which helps prevent short circuits and allows for a more compact design using less expensive substrate materials.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Volume of moving object
If traditional transformers are used, then voltage transformation function is achieved, but component size is large and power consumption is high
Solution Approach 1:
The patent transitions from planar PCB traces to three-dimensional wire bonds that extend vertically over the core, utilizing the z-dimension to create windings. This dimensional change enables compact integration while maintaining electrical isolation through the spacer structure, resolving the contradiction between small size and short circuit prevention.
Solution Approach 2:
The spacer acts as an intermediary element positioned between the core and the wire bonds, providing physical support and electrical isolation. This mediator enables the wire bonds to maintain precise spacing over the core without direct contact, preventing short circuits while allowing compact component design.
2Volume of moving object
If compact design is implemented, then component size is reduced, but manufacturing complexity increases
Solution Approach 1:
The spacer serves multiple functions simultaneously: it provides mechanical support for the wire bonds, maintains precise spacing to prevent short circuits, and enables compact integration. This multi-functionality reduces the need for additional specialized components, simplifying the overall structure despite the compact design.
Solution Approach 2:
The patent combines the core, spacer, wire bonds, and overmold into a single integrated module. This merging of components into one compact unit reduces overall complexity while achieving small size, as the elements work together as a unified structure rather than separate parts.
3Manufacturing precision
If expensive substrate materials are used, then manufacturing precision is improved, but component cost increases
Solution Approach 1:
The spacer is positioned on the core before the wire bonds are attached, establishing precise alignment and spacing in advance. This preliminary action ensures accurate positioning of the windings without requiring expensive precision substrates, as the spacer pre-defines the geometric relationships between components.
Solution Approach 2:
The spacer serves as a precision intermediary that establishes accurate spacing and alignment between the core and wire bonds. This mediator provides the necessary manufacturing precision through its structured design, eliminating the need for expensive precision substrates while maintaining alignment accuracy.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This solution enables the creation of smaller, more efficient magnetic components with improved power management, reducing costs and enhancing performance by preventing short circuits and allowing for the use of less expensive substrate materials while maintaining high efficiency and isolation.
Implementation Method 1
The primary winding(s) receive electrical energy, such as from a power source, and couples this energy to the secondary winding(s) by a changing magnetic field
Implementation Method 2
an overmold material encapsulating the core, the spacer, and the wire bonds
Data Source
AI summary
A magnetic-component module includes a substrate; a core on a first surface of the substrate; a spacer on the core; a winding including wire bonds extending over the core and electrically connecting a first portion of the substrate and a second portion of the substrate, and traces on and/or in the substrate; and an overmold material encapsulating the core, the spacer, and the wire bonds.