Magnetic Mold Clamping Test for Adhesion Force Margin
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Solution Overview
Problem
Existing methods for detecting mold adhesion to magnetic clamping devices only confirm misalignment or float, not whether the adhesion force is sufficient to prevent mold detachment, and are affected by surface roughness and dust accumulation.
Innovation Solution
A method and device that apply a weaker magnetic adhesion force using a magnetizing coil and reversible and non-reversible magnets, with a test magnetizing current to detect peeling and issue warnings, and adjust the current to ensure sufficient adhesion force, using an ignition circuit and controller to manage the magnetic clamping device.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If a magnetic clamping device uses a strong magnetic adhesion force to prevent mold detachment, then the reliability of mold fixation is improved, but the difficulty of detecting and measuring the adhesion force becomes greater
Solution Approach 1:
The patent introduces an exploring coil as an intermediary device to indirectly measure the magnetic adhesion force. Instead of directly measuring the complex magnetic force between the mold and magnetic clamping device, the system uses the exploring coil to detect magnetic flux changes, which serve as a proxy indicator for adhesion force strength. This mediator converts an difficult-to-measure quantity (magnetic adhesion force) into a measurable electrical signal.
Solution Approach 2:
The patent replaces direct mechanical or force-based measurement methods with an electromagnetic detection system. By using an exploring coil to detect magnetic flux changes, the system substitutes a complex mechanical measurement approach with a more feasible electromagnetic sensing method, enabling indirect measurement of the magnetic adhesion force.
2Strength
If the magnetic adhesion force is increased to ensure sufficient holding strength, then the mold fixation strength is improved, but the energy consumption increases
Solution Approach 1:
The patent implements dynamic adjustment of the magnetizing coil current based on real-time detection of magnetic adhesion force. Instead of maintaining a constantly high current to ensure sufficient adhesion, the system dynamically modulates the current level according to the actual adhesion conditions, using higher current only when needed to maintain adequate holding strength while reducing energy consumption during normal operation.
Solution Approach 2:
The patent changes the electrical parameter (current) of the magnetizing coil dynamically based on detected adhesion force levels. By adjusting the current parameter according to actual conditions rather than maintaining a fixed high value, the system achieves sufficient mold fixation strength while optimizing energy consumption through parameter adaptation.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
Guarantees adhesion with a margin by testing for peeling and increasing the magnetic adhesion force to ensure it exceeds the mold opening force, even with changes in surface roughness or dust accumulation.
Implementation Method 1
a reversible magnet whose magnetic poles are reversed according to a direction of an electric current flowing in the magnetizing coil
Implementation Method 2
when the mold moves slightly with respect to the magnetic clamping device, a voltage is induced in the exploring coil to detect an abnormality in the magnetization state
Data Source
AI summary
The present invention enables confirmation that a mold magnetically adhered by a magnetic clamping device has been magnetically adhered by a sufficient adhesion force so as not to be pulled off from the magnetic clamping device by a mold opening force of a mold handling device. A controller 7 carries out magnetization of a magnetic clamping device 10 such that a magnetic adhesion force weaker than that in normal magnetization is generated in a state where molds M1, M2 are bound together, and carries out a test to determine whether separation of the molds M1, M2 would occur when platens 2, 3 are separated. The controller issues a warning regarding lack of guaranteed adhesion force to an operator when separation is detected, and carries out normal magnetization of the magnetic clamping device 10 when separation is not detected.