Magnetic Package Structure for Damage-Free Electrical Connections
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Solution Overview
Problem
Existing electronic device packages face challenges in achieving reduced thickness, multi-functionality, improved performance, and lower power consumption while accommodating increased components, leading to issues like increased thickness and potential damage to magnetic materials during electrical connections.
Innovation Solution
A package structure design featuring a conductive wire encapsulated by a magnetic layer, with connection elements penetrating a dielectric layer to form electrical connections without overlapping the magnetic layer, using mechanical drilling to maintain the integrity of the magnetic layer and facilitate smoother electrical connections.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If connection elements penetrate the magnetic layer to form electrical connections, then electrical connectivity is achieved, but the magnetic layer integrity is damaged and warpage occurs
Solution Approach 1:
The connection structure is divided into two separate parts: connection elements that penetrate only the dielectric layer, and contact pads on the magnetic layer surface. This segmentation allows electrical connection without compromising the magnetic layer integrity, as the connection elements make contact with the magnetic layer at discrete contact pads rather than penetrating through it.
Solution Approach 2:
A dielectric layer is introduced as an intermediary between the connection elements and the magnetic layer. The connection elements penetrate the dielectric layer to form electrical connections, while the dielectric layer protects the magnetic layer from direct penetration damage, preventing warpage and maintaining structural integrity.
2Adaptability or versatility
If more components are added to achieve multi-functionality, then device performance is improved, but package thickness increases
Solution Approach 1:
The magnetic layer is configured with its normal direction extending in the thickness direction of the package, allowing conductive wires to be wound around it in a planar configuration. This dimensional arrangement enables multiple components to be integrated without increasing thickness, as connections are made through the dielectric layer rather than stacking components vertically.
Data Source
AI summary
A package structure and a method of manufacturing the same are provided. The package structure includes an electronic component and a first connection element. The electronic component includes a conductive wire and a magnetic layer encapsulating the conductive wire. The first connection element is electrically connected to the conductive wire. The first connection element is disposed outside the magnetic layer.