Magnetic Semiconductor Package Layout for Warpage Control
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Solution Overview
Problem
The warpage of semiconductor packages due to differences in heat expansion coefficients of semiconductor chips, epoxy molding compounds, and printed circuit package substrates leads to poor contact and reliability issues as the packages become smaller and more compact.
Innovation Solution
Incorporating magnets and magnetic layers within the substrate and semiconductor chip to utilize magnetic forces to control warpage, enhancing contact and reliability through a structured arrangement of magnets and magnetic layers.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Volume of moving object
If the printed circuit package substrate becomes thinner to achieve miniaturization, then the package size is reduced, but warpage increases due to heat expansion coefficient differences
Solution Approach 1:
The patent introduces magnets with opposite magnetic polarity to create counteracting forces that balance the warpage caused by thermal expansion coefficient differences. The first magnet is positioned at a first location and the second magnet at a second location, with their magnetic forces working in opposition to stabilize the substrate and prevent warpage deformation.
Solution Approach 2:
The patent modifies the physical parameters of the substrate by incorporating magnetic elements with specific polarities and positions. By changing the magnetic field distribution through strategically placed magnets, the substrate's dimensional stability is improved without altering its thickness or material composition.
2Reliability
If warpage is reduced through design modifications, then contact reliability improves, but device complexity increases due to additional magnetic components
Solution Approach 1:
The patent applies magnetic elements only at specific locations where warpage control is needed, rather than uniformly across the entire substrate. The first and second magnets are positioned at strategic locations to provide localized control over warpage, maintaining contact reliability without requiring complex modifications throughout the entire device.
Solution Approach 2:
The patent creates a composite structure by integrating magnetic materials (magnets with magnetic polarity) into the non-magnetic substrate material. This composite approach combines the electrical and mechanical properties of the substrate with the magnetic properties of the magnets to achieve warpage control while maintaining overall device functionality.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The magnetic forces stabilize the semiconductor chip, reducing warpage and increasing the number of contact points, resulting in a semiconductor package with reduced defects and improved reliability.
Implementation Method 1
a magnet within the insulating layer and spaced apart from the through-via, a semiconductor chip on the substrate, and a magnetic layer on the semiconductor chip and overlapping with at least a portion of the magnet in a vertical direction relative to an upper surface of the substrate
Data Source
AI summary
A semiconductor package with reduced contact defect and enhanced reliability is provided. The semiconductor package includes a substrate including an insulating layer and a through-via extending through the insulating layer, a magnet within the insulating layer and spaced apart from the through-via, a semiconductor chip on the substrate, and a magnetic layer on the semiconductor chip and overlapping with at least a portion of the magnet in a vertical direction relative to an upper surface of the substrate.