Magnetic Integrated Passive Device Structure for Compact High-Q Inductors
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Solution Overview
Problem
There is a need for smaller packages with improved performance in the field of integrated devices and integrated passive devices, particularly in achieving higher quality factor and inductance while maintaining a compact form factor.
Innovation Solution
The integration of a die substrate with a magnetic layer and metallization interconnects, which enhances the quality factor and inductance of inductors, allowing for the formation of smaller and more compact inductors while maintaining performance equivalent to larger ones.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Volume of moving object
If the size of inductors is reduced to create smaller packages, then the package size is reduced, but the quality factor and inductance performance deteriorate
Solution Approach 1:
The patent applies composite materials by integrating a magnetic layer with metallization interconnects to form a composite structure. The magnetic layer (with permeability μr ≥ 1) is combined with conductive metallization patterns to create an inductor structure that achieves high quality factor and inductance in a compact form. This composite approach allows the magnetic material to enhance the magnetic flux while the metallization provides electrical connectivity, resolving the contradiction between small size and performance.
Solution Approach 2:
The patent changes physical parameters by introducing magnetic material with specific permeability characteristics (μr ≥ 1) into the inductor structure. This parameter change enables the inductor to achieve higher inductance values and quality factors without increasing the physical size. The magnetic layer modifies the magnetic properties of the structure, allowing compact inductors to maintain or exceed the performance of larger conventional inductors.
2Volume of moving object
If the size of inductors is reduced to create smaller packages, then the package size is reduced, but the inductance performance deteriorates
Solution Approach 1:
The composite structure of magnetic layer combined with metallization interconnects enables high inductance in a small volume. The magnetic material concentrates and enhances the magnetic flux density, allowing compact inductor geometries to achieve the same or higher inductance values that would require much larger conventional structures. This directly resolves the contradiction between package size and inductance quantity.
Solution Approach 2:
By changing the magnetic parameters of the structure through the addition of magnetic material with permeability μr ≥ 1, the patent achieves higher inductance values in a compressed space. The magnetic layer increases the magnetic flux for a given current, effectively multiplying the inductance without proportionally increasing the physical dimensions, thus resolving the size-inductance contradiction.
3Reliability
If magnetic material is integrated into the packaging portion, then quality factor and inductance are improved, but the device structure becomes more complex
Solution Approach 1:
The patent merges the magnetic layer with the metallization interconnects to form an integrated inductor structure within the packaging portion. Rather than adding separate magnetic components, the magnetic material is combined with the existing interconnect structure, allowing the same structural elements to serve both electrical and magnetic functions. This merging approach improves quality factor while minimizing the increase in structural complexity.
Solution Approach 2:
The magnetic layer integrated into the packaging portion serves multiple functions: it enhances the quality factor of inductors, increases inductance values, and maintains compatibility with existing interconnect structures. The metallization interconnects simultaneously provide electrical connectivity and form the inductor traces that benefit from the magnetic material. This multi-functionality reduces the need for additional specialized components, thereby limiting the increase in device complexity.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This solution enables the creation of smaller and more compact inductors with improved quality factor and inductance, addressing the need for smaller packages with enhanced performance.
Implementation Method 1
The packaging portion includes at least one magnetic layer... The at least one magnetic layer has a permeability value (e.g., relative permeability value) that is greater than 1
Data Source
AI summary
An integrated device that includes a die substrate comprising a plurality of transistors, an interconnection portion coupled to the die substrate, and a packaging portion coupled to the interconnection portion. The interconnection portion includes at least one die dielectric layer and a plurality of die interconnects coupled to the plurality of transistors. The packaging portion includes at least one magnetic layer and a plurality of metallization interconnects coupled to the plurality of die interconnects.