Magnetic Patch Substrate Packaging for LED Displays
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Solution Overview
Problem
Conventional methods for packaging Light Emitter Diode (LED) display panels face challenges in high vacuum conditions, including glass substrates falling due to vibration and imprecise alignment, and electrostatic absorption methods being complex and prone to breakdown or insufficient adhesion.
Innovation Solution
A packaging device with magnetic patches and electromagnetic devices that securely attach and detach substrates in a high vacuum environment, using vacuum adsorption holes and electromagnetic induction coils to maintain alignment precision and prevent substrate offset.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If electrostatic absorption method is used, then the substrate can be adsorbed, but excessive static electricity causes breakdown of LED device and insufficient static electricity causes substrate to fall
Solution Approach 1:
The patent replaces the electrostatic absorption method with an electromagnetic absorption method. Instead of using electrostatic fields that can cause breakdown, the system uses electromagnetic fields interacting with a magnetic patch, providing a non-invasive holding mechanism that does not generate harmful static electricity while maintaining reliable substrate adsorption.
2Ease of operation
If pressure-vent hole is switched on/off to release adsorbed glass substrate, then the substrate can be released, but the glass substrate vibrates and offsets, adversely affecting alignment precision
Solution Approach 1:
The patent replaces the pressure-vent hole release mechanism with electromagnetic field deactivation. By simply turning off the electromagnetic device, the magnetic holding force is removed smoothly without sudden pressure changes, allowing the substrate to be released without vibration or offset, thereby maintaining alignment precision.
Solution Approach 2:
The patent employs dynamic control of the electromagnetic field to release the substrate. The electromagnetic device can be gradually deactivated or the field strength reduced, allowing controlled release of the substrate without sudden movements or vibrations, unlike the abrupt pressure change method.
3Ease of manufacture
If UV light irradiation is applied from the bottom of the component to package the substrate, then the packaging can be completed, but it is difficult to configure one static absorption device with vacuum absorption function
Solution Approach 1:
The patent designs the electromagnetic device to serve multiple functions: it provides substrate holding during alignment, maintains holding during UV irradiation from the bottom, and enables clean release after packaging. This multi-functional electromagnetic system replaces the need for separate vacuum absorption and UV irradiation systems, simplifying the overall device configuration.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
Enables reliable packaging in high vacuum conditions with improved alignment precision and secure attachment of substrates, preventing vibration-induced offset and ensuring accurate alignment and bonding of LED display panel components.
Implementation Method 1
The first platform is provided with a first electromagnetic device. The packaging device further includes at least one patch which is capable of being adsorbed by the first electromagnetic device
Implementation Method 2
the first platform is further provided with at least one vacuum adsorption hole defined therein; the vacuum adsorption hole is configured to fix the substrate to be packaged on the first platform via adsorption
Data Source
Figure 1~3
Figure 4~5b
Figure 5c~5e
AI summary
The present disclosure relates to a packaging device and a packaging method. The packaging device includes a first platform and a second platform facing the first platform. The first platform moves back and forth towards or away from the second platform. The first platform is provided with a first electromagnetic device. The packaging device further includes at least one patch which is capable of being adsorbed by the first electromagnetic device. One side of the patch is attached to the first platform, and the other side of the patch is configured to be attached to a substrate to be packaged. The substrate is detachably fixed onto the first platform.