Magnetic-Plugged Inductor Barrier Layer

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Solution Overview

Problem

Current methods for integrating magnetic materials into integrated circuit (IC) substrates are hindered by leaching issues, which disrupt processing chemistries and require redesigning or creating dedicated baths, leading to increased costs and complexity in power management solutions.

Innovation Solution

The integration of fully embedded magnetic materials within IC substrates, where the magnetic sheath is isolated from processing environments by a barrier layer, preventing leaching and allowing for the use of existing processing techniques, thus enhancing reliability and reducing development time and costs.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Reliability

If magnetic materials are introduced to increase inductance, then inductance is improved, but manufacturing process reliability deteriorates due to leaching and bath contamination

Engineering Contradiction:

ImproveinductanceVSAvoidmanufacturing process reliability

Core Design Contradiction:

ReliabilityVSEase of manufacture

Solution Approach 1:

The magnetic material is segmented into discrete particles dispersed within an encapsulating material matrix, rather than using bulk magnetic material. This segmentation prevents continuous leaching while maintaining magnetic properties for inductance enhancement.

Inventive Principle:

Principle #1Segmentation

Solution Approach 2:

An encapsulating material acts as an intermediary barrier between the magnetic particles and the processing chemistries. This encapsulation layer prevents direct contact and leaching of magnetic materials into processing baths, thereby maintaining manufacturing process reliability.

Inventive Principle:

Principle #24Intermediary (Mediator)

2Reliability

If magnetic sheath material is positioned inside and around the coil to increase inductance, then inductance is improved, but device complexity increases due to additional manufacturing steps

Engineering Contradiction:

ImproveinductanceVSAvoidmanufacturing process complexity

Core Design Contradiction:

ReliabilityVSDevice complexity

Solution Approach 1:

The magnetic particles are combined with the encapsulating material in a single composite structure that is deposited or formed together, rather than adding magnetic material as a separate subsequent step. This merging reduces manufacturing process complexity while achieving the desired inductance enhancement.

Inventive Principle:

Principle #5Merging (Combining)

Solution Approach 2:

The encapsulating material serves multiple functions: it provides structural support, prevents leaching, and acts as a matrix for dispersing magnetic particles. This multi-functionality reduces the need for additional dedicated components or processing steps, thereby reducing device complexity.

Inventive Principle:

Principle #6Universality (Multi-functionality)

3Reliability

If exposed magnetic materials are used to increase inductance, then inductance is improved, but harmful factors increase due to bath contamination during processing

Engineering Contradiction:

ImproveinductanceVSAvoidbath contamination

Core Design Contradiction:

ReliabilityVSObject-generated harmful factors

Solution Approach 1:

The potential harm of magnetic material leaching is converted into a benefit by using encapsulated magnetic particles. The encapsulation prevents contamination of processing baths, allowing the magnetic material to be used without generating harmful effects. The harmful leaching behavior is transformed into a controlled, non-leaching composite structure.

Inventive Principle:

Principle #22Blessing in disguise (Convert harm into benefit)

Solution Approach 2:

The encapsulating material creates an inert protective environment around the magnetic particles, isolating them from the processing chemistries. This inert barrier prevents chemical interactions and leaching, thereby eliminating bath contamination while maintaining the magnetic properties needed for inductance enhancement.

Inventive Principle:

Principle #39Inert atmosphere (Inert environment)

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

This approach enables the formation of co-axial inductors with increased inductance without exposing magnetic materials to harmful processing environments, maintaining existing chemistry processes and improving interface reliability and electromigration resistance.

Implementation Method 1

the magnetic sheath is separated from plated through hole by a barrier layer that is formed over an inner surface of the magnetic sheath and over first and second surfaces of the magnetic sheath

Methodology Applied

Scientific EffectPhysical containment: Physical Containment

Implementation Method 2

a magnetic sheath around the conductive through hole

Methodology Applied

Scientific EffectMagnetic permeability: Magnetism

Data Source

PatentUS11443885B2Thin film barrier seed metallization in magnetic-plugged through hole inductor

Publication Date: 2022.09.13 INTEL CORP

AI summary

Embodiments include inductors and methods of forming inductors. In an embodiment, an inductor may include a substrate core and a conductive through-hole through the substrate core. Embodiments may also include a magnetic sheath around the conductive through hole. In an embodiment, the magnetic sheath is separated from the plated through hole by a barrier layer. In an embodiment, the barrier layer is formed over an inner surface of the magnetic sheath and over first and second surfaces of the magnetic sheath.