Magnetic Polymer Insulation for Inductor Inductance and EMI
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Solution Overview
Problem
Current microelectronic devices face challenges in increasing energy efficiency, device density, processing power, and reducing power consumption and heat generation, particularly in switched inductor power conversion devices, where existing methods are limited in effectiveness.
Innovation Solution
A material comprising a polymer matrix with ferromagnetic particles of less than 10 microns is used to enhance inductance in microelectronic devices by integrating a planar magnetic core and conductive winding with a magnetic polymer insulation layer, and a magnetic underfill epoxy with ferromagnetic particles is applied to improve flip-chip attachments and reduce electromagnetic interference.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Loss of energy
If conventional photoresist polymers are used for insulation between inductor coils and magnetic core, then electrical insulation is provided, but inductance enhancement is limited
Solution Approach 1:
The patent uses composite materials by incorporating ferromagnetic particles into the polymer matrix to create a magnetic polymer that combines the electrical insulation properties of polymers with the magnetic enhancement properties of ferromagnetic particles, thereby simultaneously improving energy efficiency and inductance value
Solution Approach 2:
The patent changes the magnetic properties parameter of the insulation material by adding ferromagnetic particles, transforming it from a non-magnetic polymer to a magnetic polymer that can enhance inductance while maintaining insulation functionality
2Object-affected harmful factors
If standard underfill epoxy is used for flip-chip assembly, then adhesion and stress relief are provided, but electromagnetic interference is not attenuated
Solution Approach 1:
The patent creates a magnetic underfill epoxy by combining ferromagnetic particles with epoxy resin, forming a composite material that provides both the mechanical reliability (adhesion and stress relief) of traditional underfill epoxies and the electromagnetic interference attenuation capability of magnetic materials
Solution Approach 2:
The patent converts the potentially harmful electromagnetic interference into a beneficial effect by using the magnetic polymer to guide and contain magnetic flux, transforming EMI from a problem to be solved into a controlled magnetic field that enhances inductor performance
3Reliability
If larger ferromagnetic particles are used in the polymer matrix, then magnetic properties are enhanced, but manufacturing precision and material homogeneity deteriorate
Solution Approach 1:
The patent optimizes the particle size parameter by specifying ferromagnetic particles with an average size of less than or equal to 10 microns, which is small enough to achieve uniform distribution and good homogeneity in the polymer matrix while still providing sufficient magnetic properties for inductance enhancement
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This approach increases the effective inductance of inductor devices, enhances energy conversion efficiency, and attenuates electromagnetic interference, leading to improved performance in power converter systems and reduced heat generation.
Implementation Method 1
A material comprising a polymer matrix and a plurality of ferromagnetic particles disposed in the polymer matrix
Implementation Method 2
a magnetic underfill epoxy with ferromagnetic particles is applied to improve flip-chip attachments and reduce electromagnetic interference
Data Source
AI summary
A magnetic polymer for use in microelectronic fabrication includes a polymer matrix and a plurality of ferromagnetic particles disposed in the polymer matrix. The magnetic polymer can be part of an insulation layer in an inductor formed in one or more backend wiring layers of an integrated device. The magnetic polymer can also be in the form of a magnetic epoxy layer for mounting contacts of the integrated device to a package substrate.