Magnetic Probe Contact for Semiconductor Wafer Testing
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Solution Overview
Problem
Existing semiconductor probe test apparatuses face challenges in ensuring uniform contact force between probing needles and test pads, leading to potential contact failures and inaccuracies in wafer level testing.
Innovation Solution
A semiconductor fabricating apparatus utilizing a magnetic module with a magnetic force generator and selective contactor to generate attractive and repulsive forces, allowing for contact between probing needles and test pads without a mechanical driver, ensuring precise alignment and contact without mechanical distortion.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Force
If mechanical drivers are used to contact probes with pads, then contact force can be applied, but mechanical distortion occurs and contact accuracy decreases
Solution Approach 1:
The patent replaces the mechanical driver system with a magnetic field-based system. A magnetic force generator creates magnetic fields that interact with magnetic components on the probe card and support, enabling contact between probes and pads without mechanical actuators. This substitution eliminates mechanical distortion while maintaining the ability to apply controlled contact force through magnetic attraction and repulsion forces.
2Force
If mechanical drivers are used to ensure contact, then contact force is provided, but the apparatus structure becomes complex
Solution Approach 1:
The mechanical driver components are replaced with a magnetic force generator that produces magnetic fields to control probe contact. This simplifies the apparatus structure by removing complex mechanical actuation mechanisms while maintaining the capability to provide controlled contact force through electromagnetic interaction between the magnetic force generator and magnetic components on the probe card and support.
3Reliability
If probes are contacted with pads, then electrical connection is established, but contact uniformity is difficult to maintain
Solution Approach 1:
The magnetic field-based contact system provides more uniform force distribution compared to mechanical drivers. The magnetic force generator creates consistent magnetic fields that interact with magnetic components across multiple probes simultaneously, ensuring uniform contact force and improved contact uniformity while maintaining reliable electrical connections between probes and pads.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This solution enables accurate and uniform contact between probing needles and test pads, improving contact accuracy and simplifying the apparatus structure by eliminating the need for mechanical drivers, thus enhancing the reliability of wafer level testing.
Implementation Method 1
a magnetic module with a magnetic force generator and selective contactor to generate attractive and repulsive forces
Data Source
AI summary
A semiconductor fabricating apparatus may include a probe card, a test head, a support and a chamber wall. The probe card may include a plurality of probing needles. The probe card may be installed at the test head. The support may be configured to receive a wafer including a plurality of test pads making contact with the probing needles. The chamber wall may be configured to receive the support. The chamber wall may define a chamber in which a probe test may be performed. At least one of the probe card and the support, the probe card and the test head, and the test head and the chamber wall may be combined with each other by a magnetic module.