Magnetic Radiation Fin Attachment for Semiconductor Packages
Find Innovative SolutionsGenerate Solutions
Solution Overview
Problem
The existing methods for attaching a semiconductor package to a radiation fin, such as screw fastening and adhesive-based magnetic attachment, face issues with stress due to thermal expansion differences and require precise management of adhesive thickness, leading to potential reductions in sticking force.
Innovation Solution
The semiconductor device integrates a bond magnet and a magnetic body with the semiconductor package and radiation fin, eliminating the need for an adhesive and allowing for easier management of sticking surface heights, thereby enhancing the sticking force between the components.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If adhesive agent is used to bond magnet and magnetic body to ceramics and radiation fin, then magnetic attachment is achieved, but thickness variation of adhesive agent causes height position variation and reduces sticking force
Solution Approach 1:
The invention extracts and eliminates the adhesive agent from the bonding process. By providing the magnet and magnetic body in an integrally formed state without requiring adhesive agents, the patent removes the source of thickness variation and height position management difficulties, directly resolving the contradiction between achieving magnetic attachment and maintaining manufacturing precision
Solution Approach 2:
The patent merges the magnet and magnetic body into a single integrally formed component. This integration eliminates the need for separate adhesive bonding steps, ensures consistent height positions, and maintains reliable sticking force without the variability introduced by adhesive thickness variations
2Strength
If screw fastening is used to attach semiconductor package to radiation fin, then mechanical attachment is achieved, but thermal expansion stress deteriorates and breaks screw fastening part
Solution Approach 1:
The invention replaces the mechanical screw fastening system with a magnetic attachment system. By using magnetic force between the bond magnet and magnetic body, the patent eliminates mechanical stress concentration points that would fail under thermal expansion, while maintaining strong attachment through distributed magnetic forces
Solution Approach 2:
The patent changes the attachment mechanism from mechanical (screw) to magnetic field-based interaction. This parameter change allows for stress distribution across the entire magnetic interface rather than concentrated stress at screw points, improving reliability under thermal cycling conditions
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This solution reduces the need for adhesive management, improves the sticking force between the semiconductor package and radiation fin, and increases productivity by eliminating the need for bonding processes, while also reducing material usage and potential stress from thermal expansion.
Implementation Method 1
The semiconductor package and the radiation fin stick to each other by magnetic force occurring between the first fixed part and the second fixed part
Data Source
AI summary
An object is to provide a technique capable of suppressing reduction in sticking force of a semiconductor package and a radiation fin in a semiconductor device including the semiconductor package and the radiation fin when the semiconductor package and the radiation fin stick and are fixed to each other by magnetic force. A semiconductor device includes: a semiconductor package; an insulating substrate; a radiation fin; a first fixed part made up of one of a magnetic body and a bond magnet integrally formed with the semiconductor package; and a second fixed part made up of another one of the magnetic body and the bond magnet integrally formed with the radiation fin, wherein the semiconductor package and the radiation fin stick to each other by magnetic force occurring between the first fixed part and the second fixed part.