Magnetic Resin Inductor Substrate With Direct Plating for Higher Inductance
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Solution Overview
Problem
Existing inductor built-in substrates face challenges in increasing the ratio of magnetic material and achieving high inductance due to limitations in the formation of through-hole conductors and the reliability of plating films, which affects the inductance and reliability of the inductor component.
Innovation Solution
The solution involves a core substrate with openings and through holes filled with magnetic resin, where electrolytic and electroless plating films are formed directly on the magnetic resin, increasing the magnetic material volume and inductance, and ensuring reliable contact and uniform film thickness.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Quantity of substance
If through-hole conductors are provided in resin layer to build inductor, then inductor component can be manufactured, but the ratio of magnetic material is reduced and inductance is limited
Solution Approach 1:
The patent merges the magnetic material and resin into a single magnetic resin body, eliminating the need for separate through-hole conductors. This integration increases the magnetic material ratio while simplifying the overall structure, as the magnetic resin body itself serves as the inductor component.
Solution Approach 2:
The patent uses a composite magnetic resin body formed by mixing magnetic material with resin. This composite structure allows the magnetic material to be distributed throughout the resin matrix, increasing the effective magnetic material ratio while maintaining structural integrity and enabling direct formation of plating films.
2Reliability
If plating films are formed on magnetic resin, then inductance increases, but reliability of plating film contact may be compromised
Solution Approach 1:
The patent changes the surface parameters of the magnetic resin body through preliminary treatments (such as roughening or chemical treatment) to enhance plating film adhesion. It also optimizes plating process parameters like current density, temperature, and electrolyte composition to ensure uniform film thickness and reliable contact.
Solution Approach 2:
The patent introduces an intermediary layer or surface treatment on the magnetic resin body that facilitates better bonding between the magnetic resin and the plating film. This intermediary mechanism ensures reliable electrical contact while maintaining uniform film deposition.
3Productivity
If electrolytic plating film is formed in contact with magnetic resin body, then inductance is enhanced, but manufacturing process complexity increases
Solution Approach 1:
The patent performs preliminary actions such as forming the magnetic resin body with appropriate surface characteristics before plating, and preparing the plating solution in advance. This sequence of preliminary preparations simplifies the overall manufacturing process by ensuring that subsequent plating steps proceed smoothly with consistent results.
Solution Approach 2:
The magnetic resin body serves multiple functions: it provides the magnetic core, acts as the structural support, and serves as the substrate for plating film formation. This multi-functionality reduces the number of separate manufacturing steps and simplifies the overall production process.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This approach enhances the inductance of the inductor built-in substrate by increasing the magnetic material ratio and maintaining reliability, while also simplifying the manufacturing process by directly forming plating films within the magnetic resin through holes.
Implementation Method 1
a plating film formed in the through hole of the magnetic resin body and including an electrolytic plating film
Implementation Method 2
forming a first electroless plating film such that the first electroless plating film is formed on the first electrolytic plating film
Data Source
AI summary
An inductor built-in substrate includes a core substrate having an opening and a first through hole, a first plating film formed in the first through hole of the core substrate, a magnetic resin body having a second through hole and including a magnetic resin filled in the opening of the core substrate, and a second plating film formed in the second through hole of the magnetic resin body such that the second plating film is formed in contact with the magnetic resin body.