Magnetic Sensor Magnetism Collecting Member Surface Flatness

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Solution Overview

Problem

Existing magnetic sensors face challenges in detecting extremely weak magnetic fields with high sensitivity due to difficulties in fabricating back splitters from ferrite blocks.

Innovation Solution

A magnetic sensor design featuring a first magnetism collecting member and a second magnetism collecting member with a high-flatness surface, where the second surface is flattened to reduce gaps with the sensor chip, enhancing detection sensitivity by ensuring close contact and minimizing friction during assembly.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Manufacturing precision

If a back splitter is fabricated by cutting a ferrite block, then the magnetism collecting member can be formed, but the surface flatness is insufficient resulting in large gaps and reduced detection sensitivity

Engineering Contradiction:
Improvesurface flatnessVSAvoiddetection sensitivity
Core Design Contradiction:
Manufacturing precisionVSMeasurement precision

Solution Approach 1:

The patent applies preliminary action by performing surface flattening processing on the back splitter before assembly. The back splitter is pre-flattened by pressing it with a flat plate under a press, creating a sufficiently flat surface in advance that ensures small gaps when assembled with the sensor chip, thereby achieving high detection sensitivity without requiring extremely precise machining during final assembly

Inventive Principle:
Principle #10Preliminary action

Solution Approach 2:

The patent changes the physical state and surface parameters of the ferrite back splitter through pressing and flattening processes. By applying pressure and using a flat plate, the surface geometry parameters (flatness, waviness) are modified to achieve the required precision level, transforming the rough cut surface into a flat contact surface that minimizes gaps

Inventive Principle:
Principle #35Parameter changes

2Measurement precision

If the back splitter surface is made highly flat through additional processing, then detection sensitivity improves, but manufacturing complexity increases

Engineering Contradiction:
Improvedetection sensitivityVSAvoidmanufacturing process complexity
Core Design Contradiction:
Measurement precisionVSDevice complexity

Solution Approach 1:

The patent extracts the surface flattening requirement from the main manufacturing flow and applies it as a separate, simple preprocessing step. Instead of requiring complex precision machining throughout the manufacturing process, the flattening is taken out as a dedicated step using simple equipment (flat plate and press), reducing overall manufacturing complexity while achieving the required surface quality

Inventive Principle:
Principle #2Taking out (Extraction)

Solution Approach 2:

The patent uses a simple, inexpensive flat plate as a tool for surface flattening. This disposable or reusable flat plate, rather than expensive precision machining equipment, is sufficient to achieve the required surface flatness when combined with pressing, providing a cost-effective and simple manufacturing approach

Inventive Principle:
Principle #27Cheap short-living objects (Disposable)

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

The high-flatness surface of the second magnetism collecting member reduces gaps with the sensor chip, significantly enhancing magnetic field detection sensitivity and facilitating assembly, achieving improved performance in detecting weak magnetic fields.

Implementation Method 1

a magnetism collecting member for collecting magnetic flux in a sensor chip

Methodology Applied
Scientific EffectMagnetic flux collection: Magnetic Reluctance

Data Source

PatentUS20220299581A1Magnetic sensor
Publication Date: 2022.09.22 TDK CORP
  • US20220299581A1 patent drawing
  • US20220299581A1 patent drawing
  • US20220299581A1 patent drawing

AI summary

Disclosed herein is a magnetic sensor that includes a sensor chip having a first magnetic layer, a second magnetic layer, and a magnetosensitive element; a first magnetism collecting member covering the first magnetic layer; and a second magnetism collecting member having a body part covering a back surface of the sensor chip, a first protruding part connected to the body part and covering a side surface of the sensor chip, and a second protruding part connected to the first protruding part and covering the second magnetic layer. The second protruding part has a first surface facing the second magnetic layer. The first surface is higher in flatness than at least one of the other surfaces of the second magnetism collecting member.