Magnetic Sensor Circuit Layout for Thin Crack-Resistant Substrates
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Solution Overview
Problem
Existing magnetic sensor devices face challenges in achieving both high measurement accuracy and reduced thickness, particularly in angle sensor devices used for detecting orientation or rotation, where stress concentration and substrate cracking hinder performance.
Innovation Solution
A magnetic sensor device with a stacked structure where the sensor element circuitry perimeter is positioned differently from the sensor substrate perimeter, and trenches are formed to mitigate stress concentration, allowing for reduced thickness without distortion.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Volume of moving object
If the sensor substrate thickness is reduced to improve device compactness, then the device becomes more compact and integration is improved, but stress concentration and substrate cracking occur which reduce reliability
Solution Approach 1:
The patent segments the sensor substrate by introducing trenches that divide the substrate into multiple regions. These trenches act as stress relief structures that prevent crack propagation while maintaining substrate integrity, enabling thinner substrate design without compromising reliability
Solution Approach 2:
The patent applies local quality by creating trenches specifically at high-stress regions of the substrate. The trenches are strategically positioned to provide stress relief where needed most, allowing the substrate to be thinner overall while maintaining strength at critical locations
2Measurement precision
If the sensor element circuitry is positioned at the substrate perimeter to maximize sensing area, then measurement accuracy is improved, but stress concentration at the edges increases causing cracking
Solution Approach 1:
The patent extracts the sensor element circuitry from the substrate perimeter and positions it in the interior region. This separation removes the circuitry from the high-stress edge regions, preventing stress concentration and cracking while maintaining adequate sensing capability through proper positioning away from edges
Solution Approach 2:
The patent introduces trenches as intermediary structures between the substrate edges and the sensor element circuitry. These trenches act as stress barriers that protect the circuitry from edge-induced stress concentrations while allowing the circuitry to be positioned optimally for sensing
3Reliability
If trenches are formed to relieve stress and prevent cracking, then substrate reliability is improved, but manufacturing complexity and process difficulty increase
Solution Approach 1:
The patent implements preliminary action by forming the trenches in the substrate before mounting the sensor element circuitry. This sequence allows the trenches to be created when the substrate is still accessible and easier to modify, simplifying the overall manufacturing process while achieving stress relief
Solution Approach 2:
The patent replaces complex mechanical stress management approaches with a simpler trench-based stress relief mechanism. Instead of using complex reinforcement structures or adaptive mounting systems, the trenches provide passive stress relief through their geometric configuration, reducing manufacturing complexity
Data Source
AI summary
A magnetic sensor device includes a stacked structure including a sensor substrate and a sensor element circuitry. The sensor substrate has a surface and a perimeter. The sensor element circuitry is provided on the surface of the sensor substrate, has a perimeter, and includes one or more magnetic sensor elements. As viewed in a plane parallel to the surface, a portion or all of the perimeter of the sensor element circuitry is located at a position different from a position of the perimeter of the sensor substrate.