Magnetic Sensor Die Pad Gaps for High-Frequency Response

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Solution Overview

Problem

Existing magnetic sensors suffer from reduced frequency response due to eddy currents in the conductive die pad when exposed to high-frequency magnetic fields, limiting their effectiveness in rapidly changing magnetic field environments.

Innovation Solution

The magnetic sensor design incorporates a die pad with strategically placed gaps and frame portions to minimize eddy current interference, allowing for improved frequency response by positioning the magnetoelectric conversion units away from the die pad, thereby reducing the impact of eddy currents on the magnetic field detection.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Strength

If a solid conductive die pad is used to support the magnetoelectric conversion unit, then mechanical strength and electrical connectivity are improved, but eddy currents are generated in high-frequency magnetic fields which deteriorates frequency response

Engineering Contradiction:
Improvemechanical strengthVSAvoidfrequency response
Core Design Contradiction:
StrengthVSReliability

Solution Approach 1:

The die pad is divided into multiple separate conductive portions (first conductive portion, second conductive portion, third conductive portion) instead of a solid continuous structure. These portions are positioned at different locations beneath the magnetoelectric conversion unit, providing mechanical support and electrical connectivity while interrupting eddy current paths to improve frequency response in high-frequency magnetic field applications

Inventive Principle:
Principle #1Segmentation

2Volume of moving object

If the magnetoelectric conversion unit is positioned close to the die pad for compact design, then device size is reduced, but eddy current interference from the die pad increases

Engineering Contradiction:
Improvedevice sizeVSAvoideddy current interference
Core Design Contradiction:
Volume of moving objectVSObject-affected harmful factors

Solution Approach 1:

The die pad structure is designed with non-uniform conductive portions positioned at specific locations beneath the magnetoelectric conversion unit. The first, second, and third conductive portions are strategically placed to provide local support and connectivity while minimizing eddy current generation in areas that would directly interfere with the magnetoelectric conversion unit's operation

Inventive Principle:
Principle #3Local quality

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

The improved design enhances the magnetic sensor's frequency response, enabling it to effectively detect rapid changes in magnetic fields up to higher frequencies, making it suitable for applications involving fast-transistor inverter circuitry in electric vehicles.

Implementation Method 1

a magnetoelectric conversion unit which detects a magnetic field and converts it to an electrical signal

Methodology Applied
Scientific EffectMagnetoelectric conversion: Hall Effect

Implementation Method 2

an eddy current occurs in the conductive flat plate and a frequency response is input to the magnetoelectric conversion unit

Methodology Applied
Scientific EffectEddy current: Eddy Currents

Data Source

PatentUS12517189B2Magnetic sensor
Publication Date: 2026.01.06 ASAHI KASEI MICRODEVICES CORP
  • US12517189B2 patent drawing
  • US12517189B2 patent drawing
  • US12517189B2 patent drawing

AI summary

A magnetic sensor comprises a die pad, a first and second magnetoelectric conversion units, and a signal processing unit which processes signals output from the first and second magnetoelectric conversion unit. The die pad includes a first frame portion including a fifth and sixth frame portions, a second frame portion including a seventh and eighth frame portions, a third frame portion, a fourth frame portion, and a coupling portion. At least one of the third, fifth, or seventh frame portions has a first gap which reaches to a first space portion surrounded by the coupling portion, and the third, fifth, and seventh frame portions from an outer edge, and at least one of the fourth, sixth, or eighth frame portions has a second gap which reaches to a second space portion surrounded by the coupling portion, and the fourth, sixth, and eighth frame portions from an outer edge.