Magnetic Sensor Device With Embedded Wires And Polymer Magnet
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Solution Overview
Problem
Magnetic sensor devices face challenges in reducing fabrication steps, particularly pick-and-place steps, and in achieving a specific shape for the permanent magnet to optimize magnetic field distribution, while also aiming to minimize package size and variability.
Innovation Solution
The magnetic sensor device incorporates a magnetic sensor chip with electrical wires extending through a polymer-based magnet, where the wires are embedded and encapsulated with a material composition of magnetic particles, and features a unique end face configuration for the electrical wires to support the sensor chip, along with an encapsulation material that covers the sensor chip and wires, and includes capacitors for electrostatic discharge protection.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Ease of manufacture
If traditional pick-and-place steps are used to assemble the magnetic sensor device, then the sensor chip can be mounted on the substrate, but the fabrication process becomes complex and time-consuming
Solution Approach 1:
The patent combines the magnetic sensor chip mounting with the substrate fabrication process by integrating the chip into a recess of the substrate. This eliminates the need for separate pick-and-place steps, as the chip is positioned and fixed during the same manufacturing cycle when the substrate is being formed, thereby simplifying the overall fabrication process.
Solution Approach 2:
The substrate is prepared in advance with a recess specifically designed to accommodate the magnetic sensor chip. This preliminary structuring of the substrate allows the chip to be directly placed and fixed without requiring additional mounting steps, reducing fabrication complexity and cycle time.
2Manufacturing precision
If a standard shape permanent magnet is used, then the fabrication is simpler, but the magnetic field distribution cannot be optimized for specific applications
Solution Approach 1:
The permanent magnet is given a non-uniform shape with varying thickness or contour in specific regions. This local variation in geometry allows optimization of the magnetic field distribution in critical areas while maintaining standard fabrication processes for the overall magnet structure, balancing manufacturing ease with field precision.
3Volume of moving object
If the package size is reduced to minimize device footprint, then the device becomes more compact, but the permanent magnet shape becomes more constrained and harder to fabricate
Solution Approach 1:
The magnetic sensor chip is nested within a recess of the substrate, and the permanent magnet is positioned to utilize the space around the chip. This nested arrangement allows the device to achieve a compact footprint while maintaining sufficient space for the magnet to have an optimized shape for magnetic field distribution, without significantly increasing overall device volume.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This configuration simplifies the fabrication process, allows for a customized magnetic field distribution, and enhances the reliability of the magnetic sensor device by reducing electrical shorts and improving electrostatic discharge protection.
Implementation Method 1
A permanent magnet provides a bias magnetic field to the sensor elements
Implementation Method 2
magnetic sensor elements, such as Hall sensor elements or magneto resistive (XMR) elements
Implementation Method 3
magnetic sensor elements, such as Hall sensor elements or magneto resistive (XMR) elements
Data Source
AI summary
A magnetic sensor device includes a magnet configured to generate a bias magnetic field. A plurality of electrical wires extend through the magnet. A magnetic sensor chip is attached to an end face of a first electrical wire of the plurality of electrical wires.