Integrated Magnetic Sensor Arrangement for High-Resolution Position Detection
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Solution Overview
Problem
Existing angle and rotation measurement systems require multiple separate sensors to achieve high resolution and absolute position determination, which complicates their design and increases costs.
Innovation Solution
A measuring system with a semiconductor chip integrated magnetic field sensor arrangement that includes three perpendicular magnetic field sensors connected to an evaluation circuit, allowing for the determination of position using a single integrated sensor arrangement by modulating the magnetic field vector in different spatial directions, thereby achieving high-resolution measurements and absolute position determination.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Measurement precision
If multiple separate sensors are used to achieve high resolution and absolute position determination, then measurement precision is improved, but device complexity increases
Solution Approach 1:
The patent combines multiple magnetic field sensors (first, second, and third sensors oriented in different spatial directions) into a single integrated sensor arrangement. This merging allows the system to determine both high-resolution angular position and absolute position information simultaneously, achieving the measurement precision of multiple separate sensors while reducing device complexity by integrating them into one unified structure.
Solution Approach 2:
The integrated sensor arrangement performs multiple functions: it measures magnetic field components in three perpendicular spatial directions, determines angular position with high resolution, and simultaneously provides absolute position determination. This multi-functionality eliminates the need for separate sensors for different measurement purposes, resolving the contradiction between measurement precision and device complexity.
2Measurement precision
If multiple separate sensors are used for high resolution measurements, then measurement precision is improved, but the number of required sensors increases
Solution Approach 1:
The patent merges three magnetic field sensors that measure field components in perpendicular spatial directions into a single integrated sensor arrangement. This consolidation maintains the measurement precision required for high-resolution angular and absolute position determination while reducing the quantity of sensors from three separate units to one integrated structure.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This solution enables high-resolution angle measurements and absolute position determination with a single integrated sensor arrangement, simplifying the encoder design and reducing the number of required sensors, while maintaining high accuracy and flexibility in spatial arrangement.
Implementation Method 1
The magnetic field sensor arrangement (10) has a first magnetic field sensor (11) integrated in a semiconductor chip for measuring a first component (Bx) of a magnetic field vector (B) in a first spatial direction (x) and a second magnetic field sensor (12) integrated in the semiconductor chip for measuring a second component (Bz) of the magnetic field vector (B) in a second spatial direction (z) and a third magnetic field sensor (13) integrated in the semiconductor chip for measuring a third component (By) of the magnetic field vector (B) in a third spatial direction (y)
Data Source
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AI summary
Measuring system with a magnetic field sensor arrangement (10) comprising a first magnetic field sensor (11) integrated in a semiconductor chip for measuring a first component (Bx) of a magnetic field vector (B) in a first spatial direction (x), a second magnetic field sensor (12) integrated in the semiconductor chip for measuring a second component (Bz) of the magnetic field vector (B) in a second spatial direction (z), and a third magnetic field sensor (13) integrated in the semiconductor chip for measuring a third component (By) of the magnetic field vector (B) in a third spatial direction (y), with a sensor (30) configured to change the magnetic field vector (B) in the first spatial direction (x), in the second spatial direction (z), and in the third spatial direction (y) depending on its rotational and/or translational movement.wherein the change in the magnetic field vector (B) caused by the movement of the encoder (30) has a first periodicity (T1) in the first spatial direction (x) and in the second spatial direction (z), wherein the change in the magnetic field vector (B) caused by the movement of the encoder (30) has a second periodicity (T2) in the third spatial direction (y), wherein a first period of the first periodicity (T1) and a second period of the second periodicity (T2) are different, with an evaluation circuit (20) to which the first magnetic field sensor (11), the second magnetic field sensor (12), and the third magnetic field sensor (13) are connected, wherein the evaluation circuit (20) has a logic (25) which is configured to determine the position of the encoder (30) based on a first measurement signal (A) of the first magnetic field sensor (11), a second measurement signal (B) of the second magnetic field sensor (12), and a third measurement signal (C) of the third magnetic field sensor (13) to determine.