Wafer-Level Magnetic Sensor with Integrated Bias Magnet
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Solution Overview
Problem
Conventional magnetic field sensors face challenges in achieving perpendicular magnetic field penetration and are often complicated and expensive, particularly when used with multi-pole magnetic gear wheels, leading to undesirable limitations in positioning and orientation.
Innovation Solution
A semiconductor device with a magnetic sensor chip, an electrically conducting layer wafer-level patterned in contact with the chip, encapsulation material, and an array of external contact elements, which includes a bias magnet integrated on the wafer level to facilitate perpendicular magnetic field alignment and eliminate the need for leadframes.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Manufacturing precision
If conventional magnetic field sensors use leadframes and chip sensors positioned between magnets and movable components, then the sensors can be assembled, but the magnetic field penetration is not perpendicular and the orientation is difficult to control
Solution Approach 1:
The patent merges the chip sensor, magnet, and leadframe into a single integrated component where the magnet is directly attached to the chip sensor substrate. This integration ensures that the magnetic field lines are generated perpendicular to the chip sensor surface, eliminating the orientation control problems of conventional separate-component assemblies while maintaining assembly capability.
Solution Approach 2:
The patent introduces a magnetically permeable material as an intermediary between the magnet and chip sensor. This intermediary material shapes and directs the magnetic field lines to ensure perpendicular penetration through the chip sensor, solving the orientation problem without requiring complex positioning mechanisms.
2Reliability
If multi-pole magnetic gear wheels are used to provide the magnetic field, then the magnetic field can be generated, but the device becomes complex and expensive
Solution Approach 1:
The patent extracts the magnetic field generation function from the complex multi-pole magnetic gear wheel and implements it directly on the chip sensor through an integrated magnet. This eliminates the need for external mechanical components while maintaining reliable magnetic field generation, thereby reducing device complexity and cost.
Solution Approach 2:
The chip sensor package becomes self-sufficient by integrating the magnet directly onto the chip sensor substrate. The integrated magnet provides the magnetic field internally, eliminating the need for external multi-pole magnetic gear wheels and making the device simpler and more cost-effective while maintaining functional reliability.
3Adaptability or versatility
If conventional chip sensor packages are used, then the sensors can function, but they are subject to limitations in positioning and orientation
Solution Approach 1:
By merging the magnet, chip sensor, and leadframe into an integrated component, the patent achieves both positioning adaptability and manufacturing precision. The integrated design allows the entire assembly to be positioned as a unit while the internal magnetic field geometry ensures precise perpendicular alignment without requiring separate positioning adjustments.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This configuration allows for efficient and cost-effective magnetic field sensing by ensuring perpendicular magnetic field penetration and simplifying the sensor package design, reducing complexity and costs associated with multi-pole magnetic gear wheels.
Implementation Method 1
a magnetic sensor chip, a magnet positioned on a same side of the magnetic sensor chip as the first main face and oriented to direct magnetic filed lines through the magnetic sensor chip
Data Source
AI summary
A semiconductor device includes a magnetic sensor chip, an electrically conducting layer wafer-level patterned in contact with the magnetic sensor chip, encapsulation material disposed on the magnetic sensor chip, and an array of external contact elements electrically coupled with the magnetic sensor chip through the electrically conducting layer.