Magnetic Field Sensor Layout for Precise Wafer Positioning
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Solution Overview
Problem
There is a need for a device and system that can accurately measure and adjust the magnetic field inside semiconductor manufacturing equipment to optimize the semiconductor device manufacturing process.
Innovation Solution
A sensor device comprising a sensor unit and a processing unit that measures the magnetic field by using a combination of center, reference axis, and circumference sensors, and a method for calibrating the magnetic field based on the measured data to ensure precise control and positioning of wafers during the manufacturing process.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Measurement precision
If multiple sensors (center, reference axis, and circumference sensors) are arranged on the sensor substrate to measure magnetic field at multiple positions, then the measurement precision of the magnetic field is improved, but the device complexity increases due to the need for multiple sensors and their precise arrangement
Solution Approach 1:
The sensor substrate is divided into multiple functional regions with different sensor types: a center sensor at the center position, reference axis sensors along a straight line passing through the center, and first circumference sensors arranged on a circumference. This segmentation allows each sensor group to measure magnetic field characteristics at specific locations, improving overall measurement precision while organizing complexity through functional division.
Solution Approach 2:
Different types of sensors are placed at different locations on the sensor substrate to capture local magnetic field characteristics. The center sensor measures the magnetic field at the center position, reference axis sensors measure along specific axes, and circumference sensors measure at radial distances from the center. This local quality approach ensures that each region contributes specific measurement information, enhancing the overall measurement capability.
2Manufacturing precision
If magnetic field measurement and calibration systems are implemented in semiconductor manufacturing equipment, then the manufacturing precision of semiconductor devices is improved through better plasma control and wafer positioning, but the device complexity and cost of the manufacturing equipment increase
Solution Approach 1:
The magnetic field sensor device provides real-time measurement data about the magnetic field distribution inside the semiconductor manufacturing equipment. This feedback information is used to calibrate and adjust the magnetic field generated by magnetic coils, ensuring optimal plasma control and wafer positioning. The feedback mechanism enables continuous optimization of manufacturing precision without requiring complete system redesign.
Solution Approach 2:
The patent replaces complex mechanical positioning and adjustment mechanisms with a magnetic field-based sensing and calibration system. Instead of mechanically adjusting components to achieve precise wafer positioning and plasma control, the system uses magnetic field measurements and electronic calibration to achieve the same objectives, reducing mechanical complexity while improving precision.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The solution enables precise measurement and adjustment of the magnetic field, improving the efficiency and yield of semiconductor device manufacturing by ensuring optimal plasma control and accurate wafer positioning.
Implementation Method 1
a sensor unit that senses the magnetic field and generates sensing data
Data Source
AI summary
Disclosed is a magnetic field sensor device that measures a magnetic field, the magnetic field sensor device including a sensor unit that senses the magnetic field and generates sensing data, and a processing unit that generates magnetic field data based on the sensing data, wherein the sensor unit includes a sensor substrate, a center sensor positioned on a center of the sensor substrate on the sensor substrate, reference axis sensors arranged on the sensor substrate along a straight line passing through the center of the sensor substrate, and first circumference sensors arranged on the sensor substrate from the center along a circumference having a first radius, and the center sensor, the reference axis sensors, and the first circumference sensors measure magnetic field passing through the center sensor, the reference axis sensors, and the first circumference sensors, respectively.