Magnetic Sensor and Magnet SMD Integration on PCBs
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Solution Overview
Problem
Existing magnetic-sensor devices face challenges in efficiently integrating permanent magnets and magnetic-field sensors on printed circuit boards (PCBs) using standard surface-mount technology (SMT) processes, which limits component density and integration options.
Innovation Solution
The integration of magnetic sensors and permanent magnets as surface-mounted devices (SMDs) on PCBs, utilizing standard SMD and reflow processes, with options for adhesive, soldered, or snap-action connections, and incorporating metallizations for soldering, allows for compact arrangements and higher component density.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Quantity of substance
If permanent magnets and magnetic-field sensors are integrated on PCBs using standard SMT processes, then component density and integration options increase, but manufacturing complexity and connection reliability become challenging
Solution Approach 1:
The patent combines permanent magnets and magnetic-field sensors into a single integrated assembly that can be mounted on PCBs as one unit. This merging of components increases component density while simplifying the integration process, as the combined assembly uses standard SMT mounting techniques rather than requiring separate mounting procedures for each component.
Solution Approach 2:
The integrated assembly serves multiple functions simultaneously: it provides both the permanent magnet field source and the magnetic-field sensing capability in a single component package. This multi-functionality allows standard SMT processes to handle both magnetic components, increasing integration options without requiring specialized manufacturing steps.
2Ease of manufacture
If permanent magnets are surface-mounted on PCBs, then standard SMD and reflow processes can be used, but connection strength and positioning precision become challenging
Solution Approach 1:
The patent employs a hybrid connection approach that combines adhesive bonding with mechanical anchoring features. The adhesive layer provides strong bonding for the permanent magnet to the PCB, while recesses or protrusions create mechanical interlocking. This composite connection method maintains compatibility with standard SMD and reflow processes while significantly improving connection reliability and positioning precision.
Solution Approach 2:
An adhesive layer serves as an intermediary between the permanent magnet and the PCB, enabling reliable attachment while allowing the use of standard reflow soldering processes for the magnetic-field sensor. This intermediary material bridges the gap between different connection requirements, ensuring both ease of manufacture and connection reliability.
3Strength
If permanent magnets are embedded in electrically conductive material, then soldering connection strength increases, but electrical insulation becomes problematic
Solution Approach 1:
The patent applies electrical insulation selectively only at the locations where the permanent magnet contacts the electrically conductive material. The PCB includes insulating structures such as recesses, ridges, or insulating coatings positioned precisely at the magnet-solder interface. This localized insulation approach maintains strong soldering connections where needed while preventing electrical short circuits only at critical points, rather than requiring insulation throughout the entire structure.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This approach enables efficient population of PCBs with magnetic sensors and permanent magnets using standard SMT processes, increasing component density and integration options while avoiding complex metal grids, thus enhancing production throughput and system-level integration.
Implementation Method 1
a pre-magnetization field (bias field) produced by a permanent magnet located close to the sensor
Implementation Method 2
Magnetic sensors typically use technologies such as the Hall effect or magnetoresistive effects (MR)
Implementation Method 3
Magnetic sensors typically use technologies such as the Hall effect or magnetoresistive effects (MR)
Implementation Method 4
the permanent magnet is connected to the printed circuit board using an adhesive connection
Data Source
AI summary
The present disclosure relates to a magnetic-sensor device comprising a circuit board made of an electrically insulating material and having conductor tracks, and comprising a permanent magnet surface-mounted on the circuit board, and a magnetic-field sensor connected to the conductor tracks of the circuit board. An SMD component for populating a circuit board is also proposed, which SMD component comprises a permanent magnet and a magnetic-field sensor.