Magnetic Field Sensor Integrated Metal Clip for Current Sensing

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Solution Overview

Problem

Conventional power packages and carriers, such as circuit boards, face challenges in accurately measuring current and temperature due to the limitations of external sensors, which complicate design, or integrated electrical-type sensors that reduce precision and require costly calibration.

Innovation Solution

Integration of a magnetic field sensor, such as a magnetoresistive or Hall sensor, into semiconductor packages or standalone interconnect modules to measure current and temperature by sensing the magnetic field produced by current flowing through metal clips, allowing for precise and accurate measurements without the need for external calibration.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Measurement precision

If external components such as resistive shunts are used for current sensing, then measurement precision is improved, but device complexity increases

Engineering Contradiction:

Improvecurrent sensing accuracyVSAvoidpackage design complexity

Core Design Contradiction:

Measurement precisionVSDevice complexity

Solution Approach 1:

The patent combines the current sensing function with the existing metal interconnect structure by integrating a magnetic field sensor that detects the magnetic field generated by current flowing through the metal clip. This merges the sensing function into the interconnect itself, eliminating the need for separate resistive shunt components and reducing package complexity while maintaining measurement precision.

Inventive Principle:

Principle #5Merging (Combining)

2Device complexity

If electrical-type sensors are integrated in the power semiconductor die, then device complexity is reduced, but measurement precision deteriorates

Engineering Contradiction:

Improvepackage design complexityVSAvoidsense accuracy

Core Design Contradiction:

Device complexityVSMeasurement precision

Solution Approach 1:

The patent introduces a magnetic field sensor as an intermediary element that indirectly measures current by detecting the magnetic field generated by current flow in the metal interconnect. This intermediary approach allows accurate current sensing without integrating sensors directly into the power semiconductor die, thereby maintaining low device complexity while achieving high measurement precision.

Inventive Principle:

Principle #24Intermediary (Mediator)

3Measurement precision

If customer calibration is performed to improve sense accuracy, then measurement precision is improved, but manufacturing cost increases

Engineering Contradiction:

Improvesense accuracyVSAvoidcalibration cost

Core Design Contradiction:

Measurement precisionVSEase of manufacture

Solution Approach 1:

The magnetic field sensor system provides self-calibrating capabilities through its design, where the sensor naturally detects the magnetic field proportional to current flow without requiring external calibration procedures. The system inherently maintains accuracy through its physical principle of operation, eliminating the need for costly customer calibration processes while preserving high measurement precision.

Inventive Principle:

Principle #25Self-service

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

The magnetic field sensor provides accurate current and temperature measurements, enhancing the reliability and precision of power packages and carriers while simplifying design and reducing costs by eliminating the need for complex calibration processes.

Implementation Method 1

The magnetic field sensor is operable to sense a magnetic field produced by current flowing through the metal clip

Methodology Applied

Scientific EffectMagnetic field sensing: Magnetic Field

Data Source

PatentUS10168391B2Multi-functional interconnect module and carrier with multi-functional interconnect module attached thereto

Publication Date: 2019.01.01 INFINEON TECHNOLOGIES AG

AI summary

An interconnect module includes a metal clip having a first end section, a second end section and a middle section extending between the first and the second end sections. The first end section is configured for external attachment to a bare semiconductor die or packaged semiconductor die attached to a carrier or to a metal region of the carrier. The second end section is configured for external attachment to a different metal region of the carrier or to a different semiconductor die or packaged semiconductor die attached to the carrier. The module further includes a magnetic field sensor secured to the metal clip. The magnetic field sensor is operable to sense a magnetic field produced by current flowing through the metal clip. The interconnect module can be used to form a direct electrical connection between components and/or metal regions of a carrier to which the module is attached.