Magnetic Sensor Assembly Perpendicular Orientation
Find Innovative SolutionsGenerate Solutions
Solution Overview
Problem
Existing magnetic sensor assemblies lack sensitivity and are difficult to assemble and manufacture, as they often rely on conventional configurations that do not optimize sensor orientation and bonding methods.
Innovation Solution
A magnetic sensor assembly is designed with the sensor positioned on one of its side surfaces onto a lead frame, where the main sensor surface is oriented perpendicular to the lead frame surface, and a non-conducting layer is used to prevent electrical contact with other components, with contact pads connected by conductive glue, allowing for improved sensitivity and easier assembly through a moulded package structure.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Measurement precision
If the magnetic sensor is positioned with its main surface tilted relative to the board surface, then sensitivity is improved, but assembly complexity increases
Solution Approach 1:
The magnetic sensor is repositioned from a conventional planar arrangement to a vertical orientation where the main sensor surface is perpendicular to the lead frame surface. This dimensional change allows the sensor to detect magnetic field components in the vertical direction while simplifying the assembly process through standardized mounting interfaces.
Solution Approach 2:
A conductive adhesive is introduced as an intermediary material to bond the contact pads of the magnetic sensor to the external bond pads of the lead frame. This mediator simplifies the assembly process by providing a reliable electrical connection while accommodating slight misalignments, thereby reducing assembly complexity.
2Reliability
If conventional bonding methods (bonding wire and conductive resin) are used to connect the hall element sensor to the lead frame, then electrical connection is achieved, but manufacturing difficulty increases
Solution Approach 1:
The electrical connection function is merged into the mounting process itself. The contact pads are directly bonded to the external bond pads using conductive adhesive during the same assembly step, eliminating the need for separate bonding wire and conductive resin steps. This integration simplifies manufacturing while maintaining reliable electrical connection.
Solution Approach 2:
The complex multi-step electrical connection process involving bonding wires and conductive resins is replaced with a simpler mechanical bonding process using conductive adhesive. This substitution reduces manufacturing difficulty by consolidating multiple operations into a single bonding step.
3Measurement precision
If the magnetic sensor is positioned upright on the board surface, then sensitivity to vertical magnetic field components is improved, but assembly difficulty increases
Solution Approach 1:
The sensor is positioned upright with its main surface perpendicular to the lead frame surface, enabling detection of vertical magnetic field components. This vertical orientation is achieved through a standardized mounting interface that simplifies assembly rather than complicating it.
Solution Approach 2:
The lead frame structure is designed to serve multiple functions: it provides mechanical support, establishes electrical connections through external bond pads, and enables vertical sensor orientation for enhanced sensitivity. This multi-functionality reduces overall assembly difficulty by integrating multiple requirements into a single structure.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This configuration enhances sensitivity and simplifies the assembly process by ensuring proper alignment and bonding of the sensor and lead frame, resulting in a more efficient and manufacturable magnetic sensor assembly.
Implementation Method 1
the first plurality of contact pads are connected to a subgroup of the second plurality of external bond pads by a conductive glue
Data Source
AI summary
Magnetic sensor assembly (1) having a magnetic sensor (2) with a main sensor surface (2a) and four side surfaces (2b), and a lead frame (3) having a main lead frame surface (3a). The magnetic sensor (2) is positioned onto the lead frame (3) with one of the four side surfaces (2b), and the main sensor surface (2a) is oriented perpendicular to the main lead frame surface (3a). The magnetic sensor (2) has a first plurality of contact pads (4), the lead frame (3) a second plurality of external bond pads (5). The first plurality of contact pads (4) are connected to a subgroup of the second plurality of external bond pads (5) by a conductive glue (6).