Magnetic Sensor Stacked Element Array Layers
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Solution Overview
Problem
Conventional magnetic sensors face challenges in increasing the density of magnetoresistance effect elements without narrowing the wiring pitch, which leads to increased wiring resistance and manufacturing complexity.
Innovation Solution
A magnetic sensor design where multiple element array layers are stacked, with magnetoresistance effect elements arranged in parallel within each layer and connected in series between layers, allowing for higher density without reducing the wiring pitch.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Quantity of substance
If the wiring pitch is narrowed to densely arrange magnetoresistance effect elements, then the density of magnetoresistance effect elements is improved, but the wiring resistance increases and manufacturing difficulty increases
Solution Approach 1:
The patent transitions from a two-dimensional planar arrangement to a three-dimensional stacked arrangement by forming multiple element array layers in the vertical direction. This dimensional change allows magnetoresistance effect elements to be densely arranged across layers without requiring narrower wiring pitch within each layer, thereby increasing overall element density while maintaining manageable wiring dimensions.
Solution Approach 2:
The patent divides the magnetoresistance effect elements into multiple separate element array layers, with each layer containing a subset of elements arranged in parallel. This segmentation allows independent wiring formation for each layer using standard wiring pitch, avoiding the need to narrow wiring pitch while achieving high overall density through vertical stacking.
2Quantity of substance
If the wiring pitch is narrowed to increase element density, then more elements can be arranged, but the difficulty of wiring formation increases
Solution Approach 1:
By utilizing the vertical dimension to create multiple element array layers, the patent enables increased total element count without requiring reduced wiring pitch in the horizontal plane. Each layer can be wired using standard pitch procedures, significantly reducing wiring formation difficulty compared to attempting to fit all elements in a single plane with narrowed pitch.
Solution Approach 2:
Dividing elements into multiple layers segments the wiring formation task into manageable units. Each layer's wiring can be formed independently using conventional processes, avoiding the exponentially increasing complexity that would result from narrowing wiring pitch to accommodate all elements in one layer.
3Quantity of substance
If the wiring pitch is narrowed to achieve higher element density, then density improves, but cost increases due to higher precision facilities
Solution Approach 1:
The vertical stacking approach leverages the third dimension to achieve high element density without requiring exposure apparatus or fabrication facilities with ultra-fine horizontal resolution. Standard wiring pitch can be maintained in each layer, reducing the precision requirements for fabrication equipment compared to planar densification approaches.
Solution Approach 2:
Segmenting elements into multiple layers allows each layer to be fabricated using conventional precision standards, avoiding the need for progressively higher precision facilities that would be required to pack more elements into a single plane. This reduces overall device complexity and fabrication cost.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This approach enhances the density of magnetoresistance effect elements while maintaining the wiring pitch, simplifying manufacturing and improving detection accuracy by ensuring uniform magnetization orientation.
Implementation Method 1
magnetoresistance effect elements such as GMR (giant magneto resistance) effect elements
Implementation Method 2
TMR (tunnel magneto resistance) effect elements
Data Source
AI summary
A magnetic sensor is provided which can improve density of magnetoresistance effect elements without narrowing the wiring pitch. A plurality of element array layers 10 are stacked one on another, each of the element array layers including a plurality of magnetoresistance effect elements 1 arranged in parallel in an in-plane direction, and magnetoresistance effect elements 1 in the plurality of element array layers 10 are connected in series to each other.