Magnetic Sensor Substrate Layout for Thermal Stress Stability
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Solution Overview
Problem
Magnetic sensor devices face challenges in maintaining stable output characteristics due to adhesive issues and thermal stress caused by external forces and temperature changes, which affect the adhesion strength and connection reliability.
Innovation Solution
A magnetic sensor device design featuring a sensor substrate with a hole portion on its surface, where the adhesive is filled within the hole, and magnetic detection elements are positioned not to overlap the corners of the hole's outline, improving adhesion strength and reducing thermal stress influence.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If adhesive is applied to bond sensor substrate to support substrate, then connection reliability is improved, but thermal stress and adhesion strength instability occur due to external forces and temperature changes
Solution Approach 1:
The patent applies local quality by creating a hole portion at a specific location on the sensor substrate where adhesive is concentrated. This local adhesive concentration area provides enhanced bonding strength at the critical connection point between sensor substrate and support substrate, while the magnetic detection elements are positioned in regions without holes to maintain their functional stability and avoid thermal stress concentration.
Solution Approach 2:
The hole portion is formed in advance on the sensor substrate before bonding, and adhesive is selectively applied to this pre-defined location. This preliminary preparation ensures that the adhesive is positioned optimally to withstand thermal stress and external forces before the actual bonding occurs, improving connection reliability under temperature changes.
2Ease of operation
If magnetic detection elements are positioned on sensor substrate, then detection function is achieved, but output characteristic stability deteriorates due to thermal stress from external forces
Solution Approach 1:
The patent implements local quality by spatially separating the magnetic detection elements from the hole portion containing concentrated adhesive. The magnetic detection elements are positioned in regions without holes, ensuring they are not subjected to thermal stress concentration at the adhesive location. This local separation maintains detection functionality while improving output characteristic stability under thermal conditions.
3Ease of manufacture
If sensor substrate is bonded to support substrate, then device structure is formed, but adhesion strength varies due to thermal expansion and external forces
Solution Approach 1:
The patent applies local quality by concentrating adhesive in a specific hole portion rather than distributing it uniformly across the entire bonding surface. This localized adhesive placement provides consistent and reliable adhesion strength at the critical bonding interface, compensating for thermal expansion and external forces without compromising the overall device structure formation.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This design enhances the stability of the sensor's output characteristics by maintaining consistent adhesion and minimizing thermal stress effects on the magnetic detection elements.
Implementation Method 1
a sensor chip provided with a magnetic detection element on a sensor substrate is bonded to a support substrate with an adhesive
Data Source
AI summary
A magnetic sensor device 1 includes a support substrate 2, and a sensor substrate 10 fixed to the support substrate 2. The sensor substrate 10 includes a first surface 10B facing the support substrate 2, and a second surface 10A that is located on an opposite side to the first surface 10B and that is provided with a functional film 20 including a plurality of magnetic detection elements E, a hole portion 11 is formed in the first surface 10B, an outline O11 of the hole portion 11 includes at least one corner C1, C2, C3 . . . , and each of the plurality of magnetic detection elements E is disposed not to overlap any of the at least one corner C1, C2, C3 . . . in a plan view seen in a plane-normal direction Z from the second surface 10A toward the first surface 10B.