Magnetic Sensor Test Apparatus Using Vertical and Periphery Coils
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Solution Overview
Problem
The existing methods for testing magnetic sensors during or after packaging are inefficient, leading to increased costs and time for identifying and replacing abnormal sensors.
Innovation Solution
A magnetic sensor test apparatus and method that includes a vertical coil and symmetrically arranged periphery coils, generating magnetic fields in both vertical and horizontal directions to test the operation of magnetic sensors on a wafer, with the periphery coils arranged at an acute angle to enhance sensitivity and detection.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If magnetic sensors are tested after packaging, then the testing can be performed on finished products, but the cost and time for identifying and replacing abnormal sensors increases
Solution Approach 1:
The patent implements testing of magnetic sensors on wafers before packaging by integrating a test apparatus with coils that generate magnetic fields directly on the wafer surface. This preliminary testing approach identifies abnormal sensors early in the manufacturing process, allowing for efficient replacement before packaging operations, thereby reducing both detection time and remaking costs while maintaining high detection accuracy
2Adaptability or versatility
If a coil is equipped at multi axis in a probe card to test magnetic sensor, then the testing capability is enhanced, but the device complexity increases
Solution Approach 1:
The patent transitions from a traditional probe card with multi-axis coils to a test apparatus where coils are positioned above the wafer surface at specific angles (including acute angles less than 90 degrees). This spatial reconfiguration enables multi-axis magnetic field generation without the complexity of integrating multiple coils within the probe card structure, simplifying the device while maintaining comprehensive testing capability
Solution Approach 2:
The patent introduces a separate magnetic field generation system positioned above the wafer as an intermediary between the test controller and the magnetic sensors. This intermediary apparatus with its angled coils provides versatile testing capability while isolating the complexity from the probe card structure, allowing the probe card to remain relatively simple while achieving comprehensive sensor testing
3Measurement precision
If periphery coils are arranged at an acute angle with the wafer surface, then the sensitivity and detection accuracy is improved, but the manufacturing complexity increases
Solution Approach 1:
The patent optimizes the coil arrangement by positioning periphery coils at specific acute angles (less than 90 degrees) relative to the wafer surface. This parameter optimization enhances the magnetic field interaction with sensors at the wafer edges, improving detection sensitivity and accuracy. The specific angular parameters are chosen to balance manufacturing feasibility with enhanced measurement precision, making the angled arrangement practical to implement
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This approach allows for effective testing of magnetic sensors by generating even magnetic fields in multiple axes, improving the sensitivity and accuracy of detecting normal or abnormal sensor operations, thereby reducing remaking costs and time.
Implementation Method 1
generating a magnetic field in a vertical direction
Implementation Method 2
generating a magnetic field in a horizontal direction
Data Source
AI summary
Provided are a magnetic sensor test apparatus and a magnetic sensor test method. The magnetic sensor test apparatus includes a vertical coil and at least one periphery coil disposed peripherally about the vertical coil. Both the vertical coil and the periphery coil may be configured to generate a horizontal and/or a vertical magnetic field in a semiconductor wafer.