Magnetic Field Sensor Encapsulation with Through-Holes
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Solution Overview
Problem
Current magnetic field sensors face a challenge in achieving sufficient galvanic isolation between high voltage power paths and low voltage sensor components, especially as sensor size decreases, making it difficult to maintain reliable isolation under various environmental conditions.
Innovation Solution
The semiconductor device incorporates an encapsulation material that defines through-holes for conductive elements, providing reproducible and well-defined distances between high voltage power paths and low voltage sensor components, thus ensuring galvanic isolation through a single mold process.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Measurement precision
If the magnetic field sensor is placed as close as possible to the power path to be measured, then measurement accuracy is improved, but galvanic isolation between high voltage power path and low voltage sensor components deteriorates
Solution Approach 1:
The encapsulation material serves as an intermediary between the high voltage power path and the low voltage sensor components. It provides galvanic isolation while allowing the sensor to remain close to the power path for accurate measurement. The encapsulation material with defined through-holes acts as a mediator that enables both close proximity for measurement accuracy and sufficient isolation for safety.
2Volume of moving object
If sensor size is decreased, then device compactness is improved, but maintaining sufficient galvanic isolation becomes more difficult
Solution Approach 1:
The encapsulation material provides localized galvanic isolation properties where needed most - between the high voltage power path and the sensor components. By concentrating the isolation function in the encapsulation material rather than requiring large distances throughout the entire device, compact sensor design becomes feasible while maintaining reliable isolation in the critical local regions.
Solution Approach 2:
Instead of relying solely on increasing linear distance for galvanic isolation, the invention uses the encapsulation material to provide isolation in a different dimensional approach - through material properties and structured through-hole geometry. This allows compact three-dimensional arrangements that maintain sufficient isolation without requiring large planar separation distances.
3Reliability
If complex isolation structures are used to ensure reliable galvanic isolation, then safety is improved, but device complexity increases
Solution Approach 1:
The encapsulation material combines multiple functions into a single component: it provides galvanic isolation, defines precise through-hole positions for reproducible spacing, protects the sensor components, and enables compact packaging. This merging of functions into one integrated solution reduces overall device complexity compared to using separate components for each function.
Solution Approach 2:
The encapsulation material with pre-defined through-holes establishes the correct spacing between high voltage and low voltage components during the packaging process itself, rather than requiring subsequent adjustment or complex isolation structures. The through-hole positions are predetermined in the mold, ensuring reproducible and well-defined distances without additional complexity.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This solution simplifies installation and maintains reliable galvanic isolation, ensuring safety and accuracy in measuring high currents across different environmental conditions.
Implementation Method 1
there should be sufficient galvanic isolation between the power path, which may be at a high voltage, and the sensor inputs and outputs, which may be at a low voltage
Implementation Method 2
Current sensors based on sensing a magnetic field
Data Source
AI summary
A semiconductor device includes a substrate, a semiconductor die attached to the substrate, and an encapsulation material. The semiconductor die includes a sensing element. The encapsulation material encapsulates the semiconductor die and a portion of the substrate. The encapsulation material defines a through-hole to receive a conductive element. The sensing element may include a magnetic field sensor to sense a magnetic field generated by the conductive element.