Magnetic Sensor Vertical Chip Mounting for Miniaturization
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Solution Overview
Problem
Conventional magnetic sensors using GMR elements face challenges in reducing size due to the need for wire bonding between output terminals and connection terminals, which increases height and area, making it difficult to miniaturize the sensor.
Innovation Solution
The magnetic sensor is designed with the output terminal of the magnetic field detection chip mounted almost vertically to the substrate, allowing for closer proximity and connection of terminals, enabling ball bonding or solder bonding, and arranging multiple detection elements in a straight line on a single plane to form a bridge circuit, which reduces size and manufacturing complexity.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If wire bonding is used to connect output terminals and connection terminals, then reliable electrical connection is achieved, but the sensor height and area increase
Solution Approach 1:
The patent changes the mounting orientation of the magnetic field detection chip from parallel to vertical relative to the substrate. This dimensional change allows the output terminals to be positioned closer to the connection terminals on the substrate, eliminating the need for long wire bonds and reducing the overall sensor height while maintaining reliable electrical connection.
Solution Approach 2:
The patent extracts and eliminates the intermediate connection components (wire bonds and gold balls) by directly mounting the chip vertically so that the output terminals can be connected to the connection terminals without requiring these additional height-increasing components.
2Reliability
If wire bonding is used to connect terminals, then electrical connection is established, but the manufacturing process becomes complex
Solution Approach 1:
By mounting the chip vertically instead of parallel, the patent simplifies the manufacturing process by eliminating wire bonding and gold ball attachment steps, reducing the number of manufacturing operations required while ensuring reliable electrical connection between terminals.
Solution Approach 2:
Instead of the conventional approach of mounting the chip parallel to the substrate and using wire bonds for connection, the patent inverts the mounting orientation to vertical, which naturally brings the terminals into closer proximity and simplifies the connection process.
3Measurement precision
If conventional mounting orientation is used, then detection sensitivity is maintained, but the sensor size cannot be reduced
Solution Approach 1:
The vertical mounting orientation allows the detection elements to be arranged more compactly on the substrate, reducing the overall sensor area while maintaining the detection sensitivity by preserving the functional relationship between the magnetic field detection chip and the substrate.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This configuration allows for a more compact magnetic sensor design with improved detection accuracy and reduced manufacturing costs by simplifying the connection process and eliminating the need for additional height-increasing components like gold balls and wires.
Implementation Method 1
The GMR element is an element whose resistance value to be outputted changes in accordance with inputted magnetism. Thus, it is possible with the GMR element to measure a change in the detected magnetic field based on the outputted resistance values.
Data Source
AI summary
A magnetic sensor having a reduced size and cost is provided. More particularly, the magnetic sensor includes a magnetic field detection chip having a magnetic field detection element for detecting a magnetic field and an output terminal for outputting an output signal from the magnetic field detection element. A substrate has the magnetic field detection chip mounted thereon, and has a connection terminal for being connected to the output terminal of the magnetic field detection chip that is formed on a mount face of the substrate. An output-terminal formed face of the magnetic field detection chip is arranged non-parallel to the mount face of the substrate. More specifically, the output-terminal formed face of the magnetic field detection chip is arranged almost vertical to the mount face of the substrate.