Wafer-Level Magnetic Sensor Layout for Weak-Field Accuracy
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Solution Overview
Problem
Magnetic sensor devices face challenges in achieving high accuracy and robustness against external disturbance fields while measuring weak magnetic fields and requiring mechanical compactness, often necessitating trade-offs between conflicting requirements such as sensitivity, range, and cost-effectiveness.
Innovation Solution
A magnetic sensor device comprising multiple semiconductor substrates with a processing circuit for signal processing, connected via redistribution layers, allowing customization of sensor locations and sensitivity without redesigning the substrates, and integrated with temperature correction for improved accuracy and robustness.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Measurement precision
If multiple sensor substrates are used to measure magnetic fields at multiple locations, then measurement precision is improved, but device complexity increases
Solution Approach 1:
The device is divided into multiple independent sensor substrates, each measuring magnetic fields at different locations. This segmentation allows parallel measurement of multiple magnetic field components, improving overall measurement precision while maintaining manageable complexity through modular architecture
Solution Approach 2:
Multiple sensor substrates are merged with a single processing substrate that handles signal processing for all sensors. This combining approach consolidates the complex signal processing functions into one substrate, improving measurement precision through multiple sensors while preventing device complexity from becoming unmanageable
2Measurement precision
If sensor substrates are placed far apart to measure weak magnetic fields, then measurement precision is improved, but device volume increases
Solution Approach 1:
Sensor substrates are arranged in a three-dimensional configuration around the processing substrate rather than being placed far apart in a single plane. This dimensional arrangement allows sufficient separation for weak field measurement while maintaining compact overall device volume through spatial optimization
3Volume of moving object
If wafer-level packaging is used to reduce device size, then device volume is reduced, but manufacturing precision requirements increase
Solution Approach 1:
Multiple sensor substrates and the processing substrate are prepared and pre-assembled on a wafer before final packaging. This preliminary action on the wafer level allows precise positioning and alignment to be established early in the manufacturing process, enabling compact device volume while managing manufacturing precision requirements through controlled pre-assembly
4Adaptability or versatility
If redistribution layers are used to electrically connect substrates, then adaptability is improved, but device complexity increases
Solution Approach 1:
The processing substrate is designed with universal connection interfaces that can accommodate different configurations of sensor substrates. The redistribution layers provide flexible electrical connections that adapt to various sensor arrangements, improving adaptability while the standardized universal interface design prevents device complexity from increasing excessively
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The solution provides enhanced accuracy and robustness against external disturbances, enabling precise measurement of weak magnetic fields with increased flexibility and cost-effectiveness, suitable for various applications including E-bikes, automotive, and industrial uses.
Implementation Method 1
They are based on measuring a magnetic field characteristic at one or multiple sensor locations
Implementation Method 2
Each sensor substrate comprises a Hall element
Data Source
AI summary
A wafer-level packaged magnetic sensor device includes: a first semiconductor substrate having a processing circuit configured for receiving a plurality of sensor signals, and for determining at least one difference signal, and for providing an output signal derived from said difference signal. A plurality of sensor substrates include a second semiconductor substrate with a first magnetic sensor, and a third semiconductor substrate with a second magnetic sensor the first semiconductor substrate being arranged at a location between the plurality of sensor substrates. The substrates are electrically connected by means of at least one redistribution layer.