Magnetic Shadow Mask Positioning for Chemical-Free Coating
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Solution Overview
Problem
The lithography process for positioning shadow masks is limited by hazardous chemicals, temperature constraints, and inaccuracies, leading to unsatisfactory coating results and environmental concerns.
Innovation Solution
A device and method using a magnetic shadow mask positioned by a mask application tool with magnets, eliminating the need for lithography by securely holding and precisely placing the mask on a substrate, allowing direct coating and reducing chemical usage and process steps.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Manufacturing precision
If lithography process is used to position shadow mask, then mask positioning is achieved, but hazardous chemicals are used and require special handling
Solution Approach 1:
The patent extracts and eliminates the lithography process entirely from the mask positioning method. Instead of using photo-sensitive lacquer and chemical processing, the invention uses a mechanical positioning system with guide pins that directly place the shadow mask on the substrate, removing all hazardous chemicals from the process while maintaining positioning accuracy
Solution Approach 2:
The patent replaces the chemical-based lithography system with a mechanical positioning system. The guide pins provide precise mechanical alignment and positioning of the shadow mask directly on the substrate, substituting chemical processes with straightforward mechanical operations that are safer and more controllable
2Manufacturing precision
If lithography process is used to position shadow mask, then mask positioning is achieved, but drying times are necessary, thereby limiting throughput
Solution Approach 1:
The patent removes the drying step entirely from the process by eliminating the photo-sensitive lacquer application. The shadow mask is positioned directly using guide pins without requiring any chemical coating or drying time, thereby eliminating the throughput limitation imposed by drying requirements
Solution Approach 2:
The mechanical positioning system enables continuous operation without interruption for drying. The guide pins allow the shadow mask to be positioned and secured immediately, maintaining continuous productive action throughout the manufacturing process without idle drying time
3Manufacturing precision
If lithography process is used to position shadow mask, then mask positioning is achieved, but temperature limitations are imposed, resulting in unsatisfactory coating results
Solution Approach 1:
The patent extracts and eliminates the temperature limitation by removing the photo-sensitive lacquer from the process. Without lacquer that requires controlled drying temperatures, the system can operate across a wider temperature range, allowing for better coating results without being constrained by lacquer temperature requirements
Solution Approach 2:
The invention changes the fundamental operating parameters of the system by replacing chemical-based temperature-sensitive processes with a mechanical positioning approach. This allows temperature to be optimized for coating quality rather than being constrained by lacquer drying requirements
4Manufacturing precision
If lithography process is used to position shadow mask, then mask positioning is achieved, but inaccuracies accumulate due to several manual steps involved
Solution Approach 1:
The patent extracts and removes multiple manual steps from the lithography process, including photo-sensitive lacquer application, exposure, and development. The simplified mechanical system uses guide pins for direct positioning, reducing the number of steps and eliminating cumulative inaccuracies from multiple manual operations
Solution Approach 2:
The invention segments the positioning function into a dedicated mechanical system with guide pins that handles alignment and positioning in a single integrated operation, rather than relying on multiple sequential manual steps that each introduce potential errors
5Manufacturing precision
If lithography process is used to position shadow mask, then mask positioning is achieved, but waste is incurred, e.g., the lacquer layer that is completely discarded
Solution Approach 1:
The patent extracts and eliminates the waste-generating lacquer layer from the process. By using a mechanical positioning system with guide pins, the shadow mask can be positioned and reused without consuming any material, thereby eliminating the waste of photo-sensitive lacquer that must be discarded after single use
Solution Approach 2:
The invention enables recovery and reuse of the shadow mask by eliminating the consumable lacquer layer. The mechanical positioning system allows the mask to be removed, cleaned, and reused multiple times, converting a disposable process into a sustainable reusable system
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This solution improves coating quality, reduces waste and chemical handling, and enhances reproducibility by eliminating temperature limitations and manual inaccuracies, while enabling higher throughput and cost savings.
Implementation Method 1
an inner body comprising, at an end surface of the inner body, one or more magnets
Implementation Method 2
one or more guide elements for positioning the mask application tool on a substrate tray
Data Source
Figure 1a~1b
Figure 2
Figure 3~4
AI summary
The invention provides a device for positioning a shadow mask, the device comprising a mask application tool, the mask application tool comprising an inner body comprising, at an end surface of the inner body, one or more magnets. The mask application tool further comprises a hollow outer body for receiving the inner body, the outer body comprising, at an end surface of the outer body, a mask socket and one or more guide elements for positioning the mask application tool on a substrate tray.