Magnetic Shadow Mask for Thin Film Resistor Deposition
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Solution Overview
Problem
Conventional methods for manufacturing thin film chip resistor devices involve toxic developers and high equipment and maintenance costs, as well as environmental pollution due to chemical mask removal and deformation issues in screen printing techniques.
Innovation Solution
A method using magnetic shadow masks that detachably and fixedly contact a substrate via attractive magnetic forces to deposit resistor units with precise electrode and resistor elements, reducing the need for toxic chemicals and minimizing environmental impact.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Manufacturing precision
If photolithography with patterned photoresist is used to manufacture thin film chip resistor devices, then manufacturing precision of resistor patterns is improved, but environmental pollution and safety hazards increase due to toxic developers
Solution Approach 1:
The patent extracts and removes the photoresist development step from the manufacturing process by using a magnetic shadow mask technique. The magnetic mask directly defines the resistor pattern during deposition without requiring chemical developers, thereby eliminating toxic waste while maintaining pattern precision.
Solution Approach 2:
The patent replaces the chemical-based photolithography system with a magnetic field-based shadow mask system. The magnetic shadow mask uses magnetic field interaction to define patterns during sputtering deposition, substituting chemical development with a physical field-based approach that avoids toxic substances.
2Ease of manufacture
If screen printing techniques are used to form masks for resistor deposition, then ease of manufacture is improved, but manufacturing precision deteriorates due to mask deformation causing resistor value shift
Solution Approach 1:
The patent changes the material parameter of the mask from screen printing paste to magnetic material that can be magnetically attached. This parameter change allows the mask to be formed without deformation-prone screen printing while maintaining positional stability during deposition, thereby preserving resistor value precision.
Solution Approach 2:
The patent uses a composite approach by combining a magnetic shadow mask with a magnetic fixing member. This composite magnetic system provides both ease of attachment and dimensional stability, preventing the mask deformation issues inherent in screen printing while maintaining manufacturing simplicity.
3Ease of manufacture
If screen printing masks are used for resistor deposition, then ease of manufacture is improved, but environmental pollution increases due to chemical mask removal
Solution Approach 1:
The patent extracts and eliminates the chemical mask removal step by using a magnetic shadow mask that can be easily detached using a magnetic fixing member. The mask is removed physically through magnetic field manipulation rather than chemical dissolution, thereby eliminating chemical pollution while maintaining ease of mask handling.
Solution Approach 2:
The patent replaces the chemical-based mask removal process with a magnetic field-based detachment process. The magnetic shadow mask is attached and removed using magnetic forces between the magnetic fixing member and the magnetic mask, substituting chemical etching with a clean physical process that generates no harmful waste.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This method enables the precise formation of resistor units with reduced environmental harm and lower costs by eliminating the need for toxic developers and chemical mask removal, while maintaining accurate resistor values.
Implementation Method 1
the magnetic shadow mask detachably and fixedly contacts the second surface of the substrate by virtue of an attractive magnetic force between the magnetic fixing member and the magnetic shadow mask
Implementation Method 2
depositing at least one resistor unit on the second surface of the substrate with the use of the magnetic shadow mask
Data Source
AI summary
A method for manufacturing a thin film chip resistor device includes the steps of: disposing a magnetic fixing member on a first surface of a substrate, and disposing a magnetic shadow mask on a second surface of the substrate opposite to the first surface, such that the magnetic shadow mask detachably and fixedly contacts the second surface of the substrate by virtue of an attractive magnetic force between the magnetic fixing member and the magnetic shadow mask; and depositing at least one resistor unit on the second surface of the substrate with the use of the magnetic shadow mask, the resistor unit including two separated first electrode elements and a resistor element that electrically interconnects the first electrode elements.