Magnetic Shadow Mask Positioning Tool
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Solution Overview
Problem
The existing lithography-based process for positioning shadow masks has limitations such as temperature constraints due to photo-sensitive lacquer, hazardous chemical handling, unsatisfactory results from manual inaccuracies, and environmental concerns related to chemical waste.
Innovation Solution
A device and method for precisely positioning a magnetic shadow mask using a mask application tool with magnets, allowing for direct coating without the need for lithography. The device includes an inner body with magnets and a hollow outer body with a mask socket and guide elements for accurate positioning on a substrate tray.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Measurement precision
If lithography process is used to position shadow mask, then mask positioning is achieved, but the process involves hazardous chemicals and requires special handling
Solution Approach 1:
The patent extracts and eliminates the lithography process and its associated hazardous chemicals (photo-sensitive lacquer) from the mask positioning procedure. Instead, it uses a direct mechanical positioning system with guide elements and guide pins that physically locate the shadow mask on the substrate tray without requiring any chemical processes.
Solution Approach 2:
The patent replaces the chemical-based lithography process with a purely mechanical positioning system. The guide elements with guide pins provide mechanical guidance and positioning, substituting the need for photo-sensitive lacquer and chemical processing steps while achieving the same mask positioning function.
2Measurement precision
If lithography process is used with lacquer mask, then mask positioning is achieved, but drying times are necessary thereby limiting throughput
Solution Approach 1:
The patent removes the time-consuming drying step entirely by eliminating the lacquer-based lithography process. The mechanical guide system allows for immediate mask positioning and direct coating without any intermediate drying time, thereby increasing production throughput.
Solution Approach 2:
The guide elements and guide pins are pre-configured in the substrate tray to provide immediate mechanical positioning of the shadow mask. This preliminary mechanical setup eliminates the need for subsequent drying time required by lacquer-based methods, enabling direct coating and improving throughput.
3Measurement precision
If lithography process is used, then mask positioning is achieved, but inaccuracies in different steps accumulate particularly due to manual steps
Solution Approach 1:
The patent merges the positioning function into a single integrated mechanical system where guide elements and guide pins work together as one unified mechanism. This eliminates the multiple separate steps in lithography (lacquer application, mask placement, drying) that each introduce potential inaccuracies, thereby improving reliability and consistency.
Solution Approach 2:
The patent replaces the multi-step lithography process with a single-step mechanical positioning system. The guide elements with guide pins provide direct, repeatable mechanical positioning without the cumulative errors that arise from multiple manual operations in the lithography process.
4Measurement precision
If lithography process is used with photo-sensitive lacquer, then mask positioning is achieved, but temperature is limited by the lacquer
Solution Approach 1:
The patent extracts and removes the photo-sensitive lacquer from the process, eliminating the temperature constraint that lacquer imposes. Without lacquer to protect from degradation, the system can operate at any temperature required for the coating process, improving thermal flexibility.
Solution Approach 2:
The patent replaces the chemically-constrained lithography process with a temperature-independent mechanical positioning system. The guide elements and guide pins function purely mechanically without temperature-sensitive materials, allowing the coating process to proceed at optimal temperatures without concern for lacquer degradation.
5Measurement precision
If lithography process is used, then mask positioning is achieved, but waste is incurred including the lacquer layer that is completely discarded
Solution Approach 1:
The patent extracts and eliminates the disposable lacquer layer from the process. The mechanical guide system requires no consumable materials that are discarded, thereby eliminating the waste stream associated with lithography chemicals and reducing environmental impact.
Solution Approach 2:
The patent replaces the chemically-intensive lithography process with a mechanical positioning system that generates minimal waste. The guide elements and guide pins are reusable components that do not require disposal, eliminating the waste of photo-sensitive lacquer and other chemicals.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This solution eliminates the need for hazardous chemicals, reduces waste, and improves accuracy and reliability by allowing direct coating with precise mask positioning, thereby overcoming the limitations of the lithography-based process.
Implementation Method 1
a magnetic shadow mask can be securely held by magnetic force of the magnets
Data Source
AI summary
A device for positioning a shadow mask includes a mask application tool, the mask application tool comprising an inner body comprising, at an end surface of the inner body, one or more magnets. The mask application tool further comprises a hollow outer body for receiving the inner body, the outer body comprising, at an end surface of the outer body, a mask socket and one or more guide elements for positioning the mask application tool on a substrate tray.