Magnetic Shield Etching for MRAM Field Isolation

Resolve Bottlenecks,
Find Innovative Solutions
Generate Solutions

Solution Overview

Problem

Magnetoresistive elements in semiconductor devices, such as MRAM, are susceptible to errors due to external or stray magnetic fields, which can compromise their operation and data storage capabilities.

Innovation Solution

The integration of magnetic shields made from high magnetic permeability materials like nickel-iron alloys, such as Mu-metal, into semiconductor devices to protect magnetoresistive elements from external magnetic fields, using a manufacturing process that involves etching steps without mechanical separation to produce singulated shields without debris or burrs.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Productivity

If mechanical separation methods are used to produce magnetic shields, then production efficiency is improved, but debris and burrs are generated that compromise shield quality

Engineering Contradiction:
Improveproduction efficiencyVSAvoidshield quality
Core Design Contradiction:
ProductivityVSManufacturing precision

Solution Approach 1:

The patent replaces mechanical separation methods with a chemical etching process to produce magnetic shields. The etching process uses chemical solutions to remove material and form shields without mechanical contact, thereby eliminating the generation of debris and burrs while maintaining production efficiency. This substitution of mechanical system with chemical system resolves the contradiction between productivity and manufacturing precision.

Inventive Principle:
Principle #28Mechanics substitution (Replace mechanical system)

2Reliability

If magnetic shields are integrated into semiconductor devices, then protection from external magnetic fields is improved, but device complexity increases

Engineering Contradiction:
Improveprotection from external magnetic fieldsVSAvoiddevice structure
Core Design Contradiction:
ReliabilityVSDevice complexity

Solution Approach 1:

The patent integrates magnetic shields directly into the semiconductor device structure by forming them as part of the device fabrication process. The shields are combined with other device components and structures, merging multiple functions into a unified design. This integration approach provides magnetic field protection while minimizing the increase in device complexity through consolidated structure.

Inventive Principle:
Principle #5Merging (Combining)

Solution Approach 2:

The magnetic shields serve multiple functions within the semiconductor device: they provide protection from external magnetic fields, act as structural components, and can serve as part of the overall device architecture. This multi-functionality reduces the need for separate dedicated shielding components, thereby limiting the increase in device complexity while maintaining reliability.

Inventive Principle:
Principle #6Universality (Multi-functionality)

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

The magnetic shields effectively screen static or low-frequency magnetic fields, enhancing the reliability and data retention of magnetoresistive elements by isolating them from external influences, thereby improving the operational stability of semiconductor devices.

Implementation Method 1

magnetic shields made from high magnetic permeability materials like nickel-iron alloys, such as Mu-metal

Methodology Applied
Scientific EffectMagnetic permeability: Magnetic Field

Data Source

PatentUS10157857B2Methods for fabricating semiconductor shielding structures
Publication Date: 2018.12.18 EVERSPIN TECHNOLOGIES INC
  • US10157857B2 patent drawing
  • US10157857B2 patent drawing
  • US10157857B2 patent drawing

AI summary

The present disclosure is drawn to, among other things, a method of forming a semiconductor shield from a stock material having a thickness. In some aspects the methods includes providing a first layer of material on a first surface of the stock material, wherein at least a portion of the first layer of material includes a first window that exposes a portion of the first surface; providing a second layer of material on a second surface of the stock material, wherein the second surface of the stock material is spaced from the first surface by the thickness of the stock material, and wherein at least portion of the second layer of material includes a second window that exposes a portion of the second surface; and selectively removing a portion of the stock material exposed at the first or second windows, wherein the portion removed includes less than an entirety of the thickness of the stock material.