Magnetic Shield Structure for Uniform IC Field Isolation
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Solution Overview
Problem
Current magnetic shields for integrated circuit chips, such as MRAM chips, are inefficient in shielding against external magnetic fields, leading to potential malfunctioning due to disturbances in the magnetization direction of the free layer.
Innovation Solution
A magnetic shield structure comprising a shell made of magnetic material over a base plate, forming a chamber to enclose the chip mounting region, with vias providing high reluctance paths for external magnetic fields, ensuring uniform isotropic shielding.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If current magnetic shields are used for integrated circuit chips, then the chip is provided with some form of shielding, but the shielding efficiency is low and external magnetic fields can still disturb the magnetization direction of the free layer
Solution Approach 1:
The magnetic shield structure employs a composite design consisting of a base plate and a shell both made of magnetic material, forming a complete enclosing structure. This composite approach combines multiple magnetic material components to achieve superior shielding efficiency compared to single-material shields, effectively blocking external magnetic fields from disturbing the MRAM chip's magnetization direction.
Solution Approach 2:
The magnetic shield structure serves multiple functions: it provides magnetic field shielding, encloses the chip mounting region, and protects the MRAM chip from external magnetic disturbances. The base plate and shell configuration creates a universal shielding solution that can accommodate different chip sizes and configurations while maintaining effective magnetic field protection.
2Reliability
If a magnetic shield structure with base plate and shell is used, then uniform isotropic shielding is provided, but the device complexity increases
Solution Approach 1:
The magnetic shield is segmented into two distinct components: a base plate and a shell. This segmentation allows for simplified manufacturing of individual parts that can be separately produced and then assembled, reducing overall device complexity while achieving uniform isotropic shielding when the components are combined.
Solution Approach 2:
The base plate and shell are nested together to form a complete magnetic shield enclosure, with the shell positioned over the base plate. This nesting arrangement creates a compact structure that provides uniform isotropic shielding while minimizing the overall footprint and simplifying the integration process into existing chip packages.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The solution effectively shields integrated circuit chips from external magnetic fields, preventing disturbances and ensuring reliable operation by providing improved magnetic shielding efficiency.
Implementation Method 1
The shell comprises a magnetic material
Implementation Method 2
The solution effectively shields integrated circuit chips from external magnetic fields
Data Source
AI summary
A shield structure for a semiconductor chip comprises a chip mounting region on a base plate and a shell connected to the base plate. The shell is arranged over the base plate to provide a chamber having a volume, and the chip mounting region is arranged within the volume.