Magnetic Shielded Semiconductor Package for MRAM Field Protection
Find Innovative SolutionsGenerate Solutions
Solution Overview
Problem
Magnetic devices such as MRAMs are sensitive to external magnetic fields, which can cause anomalies, malfunctioning, and damage by altering magnetization and polarity, leading to issues with memory storage and device operation.
Innovation Solution
A package structure incorporating magnetic field shieldings, including upper, lateral, and lower magnetic field shieldings made of paramagnetic, ferromagnetic, or high permeability materials, is designed to mitigate the effects of external magnetic fields by providing a lower reluctance path for magnetic flux, thereby protecting the magnetic devices.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If magnetic field shieldings are added to protect magnetic devices from external magnetic fields, then reliability is improved, but device complexity increases
Solution Approach 1:
The patent implements nested magnetic field shieldings where an upper magnetic field shielding is positioned over a lateral magnetic field shielding, which in turn surrounds a lower magnetic field shielding. This nested configuration provides multi-layered protection against external magnetic fields while efficiently utilizing the package structure space, thereby improving reliability without excessive complexity increase.
Solution Approach 2:
The magnetic field protection is divided into multiple segmented components: upper magnetic field shielding, lateral magnetic field shielding, and lower magnetic field shielding. Each segment is positioned at different locations and orientations to provide comprehensive protection from various directions, allowing the system to achieve reliable magnetic field shielding through modular components rather than a single complex structure.
2Reliability
If multiple magnetic field shieldings are implemented, then protection effectiveness is improved, but manufacturing complexity increases
Solution Approach 1:
The magnetic field shieldings are implemented as thin film structures that can be deposited using standard semiconductor fabrication techniques. These thin film magnetic field shieldings provide effective magnetic shielding while being compatible with existing manufacturing processes, thereby improving protection effectiveness without significantly increasing manufacturing complexity.
3Reliability
If magnetic field shieldings are added, then device reliability is improved, but the package size increases
Solution Approach 1:
The nested configuration of upper, lateral, and lower magnetic field shieldings allows the protective structures to be positioned within and around the existing package volume efficiently. The lateral magnetic field shielding surrounds the lower magnetic field shielding, which in turn is surrounded by the upper magnetic field shielding, maximizing protection within minimal additional space.
Solution Approach 2:
The magnetic field shieldings are arranged in three-dimensional space with the upper shielding positioned vertically over the lateral shielding, which horizontally surrounds the lower shielding. This multi-dimensional arrangement provides comprehensive magnetic field protection from all directions while efficiently utilizing the available package volume, minimizing the increase in overall package size.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The magnetic field shieldings effectively reduce the impact of external magnetic fields on magnetic devices, preventing anomalies, malfunctions, and damage, while also enhancing the mechanical strength and miniaturization of the package structure.
Implementation Method 1
designed to mitigate the effects of external magnetic fields by providing a lower reluctance path for magnetic flux
Implementation Method 2
upper, lateral, and lower magnetic field shieldings made of paramagnetic, ferromagnetic, or high permeability materials
Implementation Method 3
upper, lateral, and lower magnetic field shieldings made of paramagnetic, ferromagnetic, or high permeability materials
Data Source
AI summary
A package structure includes a mounting pad having a mounting surface; a semiconductor chip having a magnetic device, a first magnetic field shielding, and a molding. The semiconductor chip comprises a first surface perpendicular to a thickness direction of the semiconductor chip, a second surface opposite to the first surface, wherein the second surface is attached to the mounting surface of the mounting pad, and a third surface connecting the first surface and the second surface. The first magnetic field shielding including a plurality of segments laterally at least partially surrounding the semiconductor chip, wherein a bottom surface of the first magnetic field shielding is attached to the mounting surface of the mounting pad, wherein the mounting surface comprises first portion free from overlapping with the first magnetic field shielding from a top view perspective. The molding surrounding the mounting pad and in direct contact with the mounting surface.